Electronics Forum | Thu Feb 17 10:14:40 EST 2000 | Jim N
We bulid many boards with fine pitch on solder side and then wave. We use a wave fixture that is custom for each board. The fixture covers the SMT components and only exposes the PTH lead during the wave process. It requires about .070 to .100" clear
Electronics Forum | Mon Nov 13 04:57:27 EST 2000 | Wolfgang Busko
Hi Richard, I assume that you deal with a component that has 20mil pitch. In this case depending on your pad design you get from 8 to 10mil spacing for your apertures. With a slight reduction of the aperture (10 to 15% for avoiding shorts)and a 6mil
Electronics Forum | Sat May 09 11:46:43 EDT 1998 | Bob Willis
The first thing is all the TSOP suppliers like Intel do not rate the parts at normal temperature used in wave soldering. The spec is less than 230C so you have the reliability issue to consider and no one to blame when they do not work. You also have
Electronics Forum | Fri Sep 21 10:44:34 EDT 2001 | slthomas
You can, and for small parts you probably won't see much difference between body temp. and lead temp. For QFPs or PLCCs there will be a much greater delta, though. I'd be more concerned with the small surface area you're making contact on (spherica
Electronics Forum | Mon Jan 14 19:22:54 EST 2002 | wsanita
The great thing about Mydata is the ability to put small strips of components on the Y-table. Takes only a few minutes to setup. I build mainly protos and small lots. The y axis is the table. The head is the x. Any problems you may have heard of were
Electronics Forum | Wed Mar 30 15:16:35 EST 2005 | Rashid
Hi, I've measured a rework profile on a summit 750. my nearby parts are heating up as high as 178 to 182 degrees C. I'm concerned that this fine pitch parts that are nearby are affected specially their solder joints going to close to melting point.
Electronics Forum | Wed Oct 26 14:20:41 EDT 2005 | TPM
Brian, We have the Mirtec Table Top. It is very good at detecting the component and orientation. It is however only as good as we program it to be. We have seen some limitations in respect to solder connections. I have not found it to be 100% re
Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514
Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh
Electronics Forum | Tue Oct 17 17:27:08 EDT 2006 | adlsmt
Define "pretty easily". Did anyone ever do whatever is making them fall off now before? In most casses where a component "falls off" then someone implements a totally subjective test to make sure the rest of the parts wont "fall off" they damage a lo
Electronics Forum | Thu Feb 07 05:18:08 EST 2008 | muarty
If there is a budget available, rather than looking at a Fuji CP7. Being issued with small strips of components would prove to be a nightmare with this style of placement machine. I would try to consider the Fuji AIM machine for use as the chipshoote
