Electronics Forum | Sun Dec 11 08:13:27 EST 2005 | stepheniii
If you are taking off the old BGA then the board finish is not the same as it was orginally. I would want to clean the pads off as much as possible and then use sticky flux with the new BGA. But on the other hand, Aim solder has an article about smal
Electronics Forum | Wed Dec 14 06:18:20 EST 2005 | tk380514
right again grant, consider the fact that if you spend enough time inspecting the soldered boards/pre-oven and check the BGA solder paste pads before, and clean the stencil regularly and check solder paste dryness, check oven profiles then after chec
Electronics Forum | Thu Dec 08 22:41:44 EST 2005 | davef
Mike: You're correct, but in better shops there are guys with little black books in their back pocket. They know how to contol their variables and give you a good product. I worked at this plant where we cooked dirt. It glowed orange-red and flow
Electronics Forum | Fri Dec 09 08:53:12 EST 2005 | russ
We used flash gold once by mistake and we did pay for it. A very high fallout of BGAs and some of the leaded devices for latent failures from fractured solder joints. I do not know how the other types of components faired in this process but I woul
Electronics Forum | Tue Dec 13 22:44:35 EST 2005 | Mike Kennedy
Russ, After a bit more research, I have found that the FLASH gold process doesnt use Phophrous in the process so should not have the black pad problems of ENIG. I am now surprised that you had problems. What did you experience? Was it an oxsidisation
Electronics Forum | Wed Dec 14 08:58:27 EST 2005 | russ
We experienced brittle solder joints that did not withstand thermal cycling as I was told. I am positive about the fractured joints but was informed by customer that it was thermal cycling of the part when they failed so they were latent failures.
Electronics Forum | Thu Dec 15 19:47:43 EST 2005 | Liza
Hi GS, You mentioned that polystyrene should be sealed by low method. We are currently using the ffg parameters for polystyrene monolayer dull finish carrier tape and AA cover tape. Are these considered low by standard? These are the parameters r
Electronics Forum | Sat Dec 17 07:19:37 EST 2005 | aj
All, I am currently finishing off my PO for solder bars,paste,solder wire and Flux for the changeover to leadfree. Surely the company is not expected to take the full hit on this cost alone? I know there is some funding available for this but as f
Electronics Forum | Wed Dec 28 03:33:31 EST 2005 | sparrow
I would like to know if ENIG is widely used for the thermosonic gold wire bonding or this application is an exotic one. And I also wold like to talk to someone who uses printed circuits with ENIG finish for such an application. I do not quite underst
Electronics Forum | Thu Jan 12 17:35:34 EST 2006 | russ
We use immersion Silver for all of our lead free PCBs. They come in the "silver saver" paper you speak of and we have found that they will tarnish after 7 days in the open enviroment. Even with this tarnish we experienced no reflow problems. We are
