Electronics Forum: finish (Page 71 of 229)

Immersion Palladium Surface Finish

Electronics Forum | Wed Jan 11 15:01:40 EST 2006 | Amol Kane

we have shortlisted Immersion Ag and Sn.....do you have any special storage conditions in yr facility for Immersion Ag boards?

Immersion Palladium Surface Finish

Electronics Forum | Thu Jan 12 15:36:42 EST 2006 | amol_kane

do you have sulpher papers in the packaging? i thought they had to be stored in a controlled humidity environment. also, if i may ask, what is the mean time between receiving a bare board and reflow? Thanks in advance, Amol

SN100C: High Temp

Electronics Forum | Fri Jan 20 17:04:21 EST 2006 | George

adlsmt, Solder pot temp is set to 265C. About solder joint quality, you must take in consideration the PCB finish when testing different leed-free alloys. Our PCB's are ENIG.

Best contrast for Fiducials

Electronics Forum | Tue Jan 24 11:59:55 EST 2006 | Chunks

Tell your board house/customers you want "non-smobc". hich stands for non-solder maske over bare copper. MPMs love exposed fids in just about any finish. You can always use pads on an MPM too.

Tented vias on ENIG boards

Electronics Forum | Tue Jan 31 15:44:08 EST 2006 | John S.

We're looking at lead free surface finishes for some of our products. On one supplier's site, I found a note that tenting vias on ENIG boards can lead to the black pad phenomenon. How does this compare to your design guidelines and experience? Than

PACE TF1500 or 1700 BGA Rework feedback

Electronics Forum | Thu Feb 23 17:50:57 EST 2006 | russ

The 1700 has more manual operator input ability than the 1500. You can stop and start or whatever without waiting for the machine commands or cycles to initiate or finish.

Voids

Electronics Forum | Wed Mar 01 11:51:04 EST 2006 | ajaygarg1980

we are observing voids in solder ball bonding process using laser.Final metal finish is of Au on Cu.Can anyone tell me the reasons or solution for this problem.We are not using any flux at all.

solderballs/solderbeads

Electronics Forum | Sun Mar 19 15:50:14 EST 2006 | ausajid

hi any body can help reducing/completely finishing of solderballs / solderbeads after reflow on surface mount. i will be appreciated upon suggestions and techniques. regards

Gold Flash with QFN28 problem

Electronics Forum | Thu Mar 30 08:59:46 EST 2006 | Dan

Yes the balls are at the outer edge. The chips we have are not showing exposed copper, but the lead-free finish...

Capacitor Failure

Electronics Forum | Wed Apr 26 11:33:49 EDT 2006 | Rob

I'm guessing it's part No. GRM21BR60J226ME39, which has a Matte tin finish.


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