Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs
What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ
Electronics Forum | Mon May 15 12:36:12 EDT 2017 | edhare
I don't believe there should be any issues with > the HASL finish. The issue is how long on the > shelf and is a bake out required to remove > moisture from PCB, as in any FR4 PCB's that may > have had time to absorb moisture. > I don't believe
Electronics Forum | Tue Jun 05 02:10:01 EDT 2018 | buckcho
Hello sir, Limits in SPI can vary a lot, also depending on finishing of the pcb. For example 170% volume on an IC (assuming is fine pitch) can be okay for ENIG, but very bad if HASL. For are I would recommend that you use either 50-130, or 60-135 max
Electronics Forum | Thu Mar 25 23:23:00 EDT 2021 | llawrence
The QFP pitch is 0.5mm. Pad size is 1.475 x 0.3mm, and the new aperture size is 1.32 x 0.22mm. I'm not sure about whether or not it is lasered, but on the newly ordered stencil I selected the polishing option. Looks like the pad width is already 2/3
Electronics Forum | Thu Mar 02 04:23:49 EST 2000 | Alan
Hi, I'm trying to put together a directory of component manufacturers that offer a lead free alternative for their devices. If anyone knows of manufacturers that are producing these devices then it would be greatly appreciated if you could pass the
Electronics Forum | Mon Nov 13 20:55:11 EST 2000 | Dave F
Not too much to go on, bud. Tell us about: * Wire material, finish, insultation, etc * Wetting problem description * Why feed that the wire is used for through is important * Range and extent of the problem * Results of metallographic analysis of "g
Electronics Forum | Mon Oct 23 21:05:37 EDT 2000 | cklau
If you're looking for PWB cleanliness , please consider one surface treatment other than HAL (i.e HRF-heat resist flux). HRF is a very inexpensive and effective process that your board manufacturer can provide you to meet your requirement. For gold
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Mon Sep 11 04:23:49 EDT 2000 | Wolfgang Busko
Adam: I would say that you do have a reliability problem. - check parts for solderability - check your board finish - check your profiles - check your paste - check your processes with focus on cleanliness - do some mechanical tests, you should rath
Electronics Forum | Wed May 24 12:15:53 EDT 2000 | Wolfgang Busko
Bill, I would assume that the stencil rests on the soldermask especially when you use a metallblade. If you know the difference in height between soldermask and land you could take that into your volume calculation when figuring out your desired ste
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