Electronics Forum | Thu Apr 22 15:27:44 EDT 1999 | Hugh M
| | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | You are hearing about polyimide as in polyimide film as Kapton (TM Dupont). This material is the stuff of flex and rigid/flex c
Electronics Forum | Wed Feb 20 13:23:33 EST 2002 | dgeorge
I have some interesting problems on my hands that some of you may know the answers to. I am currently wave soldering a through hole connector to a rigidized flexible circuit. This is a compliant pin connector that is supposed to be pressed into a h
Electronics Forum | Tue Dec 08 11:49:44 EST 1998 | Dave F
All Y'All: A recent (10/98) article in "Circuits Assembly" magazine touted the use batch cleaners using a aqueous alcohol solvent. Reported benefits of this approach were: 1 Better use of floor space 2 Ability to develop custom recipes 3 Ability
Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef
IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as
Electronics Forum | Fri Nov 13 23:33:33 EST 1998 | Kallol Chakraborty
| | | I believe that gold fingers on my circuit boards are being | | | contaminated and need to clean them with some chemical | | | solution. Any recommendations. | | | | | Chuck: What is the type and source of your contamination? Dave F | | We a
Electronics Forum | Sat Nov 14 08:05:54 EST 1998 | Earl Moon
| | | | I believe that gold fingers on my circuit boards are being | | | | contaminated and need to clean them with some chemical | | | | solution. Any recommendations. | | | | | | | Chuck: What is the type and source of your contamination? Dave
Electronics Forum | Wed Dec 09 19:21:13 EST 1998 | Bill Schreiber
Dave, Be careful if you plan to clean misprinted PCBs in a spray type batch cleaner. There is an article written by Dick Clouthier of AMTX Stencils regarding batch cleaners and their use for cleaning misprints. He describes it as a "solder ball nig
Electronics Forum | Thu Jul 30 14:16:32 EDT 1998 | Phil Crane
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Sun Aug 02 06:54:26 EDT 1998 | Bob Willis
You may liketo contact Chemtech in the UK. http://chemteck.co.uk as they have a new hand book on stencils and a design guide due for release shortly there is also some stencil information as a survey on types and price on my web sites under surveys h
Electronics Forum | Mon Jul 01 20:45:38 EDT 2002 | davef
Solder mask thickness specifications by fabricators are: * Wet mask: 0.0002 ~ 0.0004� on trace * LPI mask: 0.0002 ~ 0.0008� on trace Liquids usually range between 10 to 13 um (0.00039 to 0.00051") when dried. Liquid resist processes I have seen are
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