Electronics Forum: flip chip problem (Page 1 of 107)

Conductive Adhesives and flip chip

Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan

HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver

flip chip tolerances

Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont

I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Re: flip chip bonder

Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel

Re: flip chip bonder

Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det

Conductive Adhesives and flip chip

Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef

Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur

chip placed upside down

Electronics Forum | Sat Jun 07 23:37:34 EDT 2014 | demzvill

Hello all Good morning. I just want to ask with you guys about the problem that we always experienced in our production. We could not get our target ppm due. to inverted placement of chip resistor. We are using 2000 series juki mounter and cf03hp j

chip placed upside down

Electronics Forum | Wed Jun 11 16:41:57 EDT 2014 | isd_jwendell

With Essemtec software you can specify to turn on vacuum once the nozzle is down at the part. The default method is to turn on the vacuum while the nozzle is up, but starting to move down. For light/tiny parts this can have the effect of making them

chip placed upside down

Electronics Forum | Tue Jun 10 15:47:18 EDT 2014 | hegemon

Possibly the components have been re-taped in that particular reel, with only electrical function in mind? Hard to see a nozzle causing a flip, and I am thinking if your feeders are vibrating bad enough to flip the components in the tape, that you

Re: Flip chip placer

Electronics Forum | Mon Mar 09 15:53:05 EST 1998 | Tom Foley

| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. Take a close look at the Philips ACM. The ACM is engineere

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