Electronics Forum | Thu Jun 19 10:47:29 EDT 2003 | Eric QE
Caltex or Ersa type system is good, Caltex prisms, necessary for looking underneath the BGA can be crashed easily when looking under low profile or Micros. $40-$110 each depending on the availability and who makes 'em. We have 2D and 3D X-ray avai
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
Electronics Forum | Tue Aug 05 21:18:24 EDT 2003 | cardinal
Hi, One thing you might want to do has to deal with the venting over the top of your spray fluxer. Many times the exhaust comes from the side; instead of directly inline on top of the spray fluxer. This will draw the flux up the thru-hole joints m
Electronics Forum | Wed Sep 03 18:20:00 EDT 2003 | davef
Major advance: Productionization of SMT. Minor advances: * Realization and control of solder paste characteristics * Vision alignment controls in printers. * Evolution from mechanical centering [through laser alignment controls] to vision alignment
Electronics Forum | Tue Sep 16 09:59:26 EDT 2003 | James
I am having a problem with SOT23 moving off their pads during reflow. We did not have this problem yesterday. On the pads and surrounding area looks like a lot of flux spatter. I looked through the threads but they didnt help me much. I know what 3
Electronics Forum | Fri Sep 26 08:15:01 EDT 2003 | Gabriele
Forced gas (hot air or N2 according to solder paste or flux) will be the solution. To rework Ceramic (Aluminum lid Heat Sink)BGA (32 mm square ) or Ceramic Colum Grid Array C-CGA 1,25 and 1,00 mm colum (pitch 42,5mm square), also them capped with a
Electronics Forum | Wed Oct 01 13:39:13 EDT 2003 | arturoflores
They take the solder in a dip and look solderability test but when in normal reflow process we got some pins that do not get wet and the appearance is as follows: -Pillow effect on the toe(no front fillet is formed) -There is a sheet of flux between
Electronics Forum | Sat Oct 04 00:21:00 EDT 2003 | Dean
It would help to run a carbon, anion, cation, mixed-bed configuration with pure DI as the final rinse. IF your incomming water is really bad you can run a RO unit to "prepare" the water for ion exchange. Do you run omega meter or ionograph testing
Electronics Forum | Mon Oct 27 16:58:34 EST 2003 | Stephen
The most common way is to screen print paste for the SMT placement, then then SMT placement then reflow then TH placement followed by wave solder. You won't be able to screen print for the BGA after reflow unless you use a mini stencil. Or you co
Electronics Forum | Wed Nov 19 16:35:27 EST 2003 | davef
We'd be incluned to dip the BGA ball in tacky flux, place the BGA on the PTH interposer, reflow that suka, and get on with things. [Take the people involved out to lunch with the money you save on not buying a stencil.] On damaging the glop top, we'
