Electronics Forum | Thu Sep 02 07:22:03 EDT 1999 | Earl Moon
| I'd like to know the advantages and disadvantages between the two. | | Thanks and regards, | | Both have their place. When using less fine pitch (.025" +) with fine pitch (.020" or less and BGA's) a .007" thick stencil may be used. This would re
Electronics Forum | Thu Dec 24 02:21:15 EST 1998 | Chris Grendler
Any one know a good stencil vendor who can produce stencils below .002" foil with appetures at .004" on .008" pitch? AMTX use to be my vendor but they are closed down. Thanks, Chris Grendler
Electronics Forum | Fri Jul 31 17:21:38 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Fri Jul 31 17:23:11 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Fri Jul 31 17:24:12 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Wed Aug 05 07:44:18 EDT 1998 | Joe Vella Ottosen
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Mon Jul 22 08:27:51 EDT 2002 | davef
Look here; http://www.unitekeaprosystems.com/res_tech/pdf/HDHBCWAB.pdf ACF Bonding. Anisotropic Conductive Film / Anisotropic Conductive Foil Bonding.
Electronics Forum | Thu Apr 03 18:10:08 EST 2003 | Print Master
0402 Adhesive printing is possible with thicker stencils in order to allow mixed component technology. We have successfully printed 0402's with a 0.008" thick SS foil. Total material release is not achievable at this thickness, but not required u
Electronics Forum | Tue Jul 22 03:56:24 EDT 2003 | A.G.
Are there existing acceptability dedicated criteria for ALIVH bare boards? (Equivalent to IPC-A-600) In particular, how can we assess copper foil cracking after thermal stress?
Electronics Forum | Thu Sep 25 18:31:24 EDT 2003 | davef
Denis: You could be correct about metal reflecting IR. When we use our old IR station, we place pieces of aluminum foil around the component to be removed to protect the near-by components.
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