Electronics Forum: following (Page 191 of 254)

FormFlex

Electronics Forum | Wed Sep 19 09:34:08 EDT 2001 | jschake

Both FormFlex and Grid-lok tooling systems are marketed as compliant tooling systems. Both are able to conform to the variations of the topography on the bottomside of a substrate to provide full support during printing of 2nd side assembly. The ba

DEK 288 machine...

Electronics Forum | Thu Sep 20 09:12:28 EDT 2001 | jschake

If you were successful in running the machine in dry cycle mode, then I would expect with new squeegees that the prints would be acceptable. To give you more tangible data on what you may expect from the actual print results, maybe you could run the

Placement Program Tweaking

Electronics Forum | Mon Oct 15 16:56:18 EDT 2001 | davef

First, I�d like to kiss-up to the people that are likely to be responding to this question. Thank you for contributing to my recent query about placement program control. OK. Let�s talk about �good practices� in placement programming. Throw in an

SPC on SMT

Electronics Forum | Wed Nov 21 05:06:31 EST 2001 | frha

Thanks Mr Parker! I understand that the basic "demming-wheel" needs to be on place first. My contract manufacturers list ALL adjustments, failures etc during the production, and we also discuss the statistics (pareto) and corrective actions for all d

Solder Paste Printed Volume

Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker

1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre

Saponifier Concentration Measurement

Electronics Forum | Mon Aug 26 12:44:42 EDT 2002 | dragonslayr

Scott- I've used both methods, titration and refractometer. Both are simple to perform. Titration is a simple, high school science class type process. Follow the chemical mixes accurately and then compare the resulting color change of liquid to a cha

lead substrate materials

Electronics Forum | Tue Jan 29 20:14:54 EST 2002 | davef

Please help us understand your situation better by describing the following: * Component [ie, PTH/SMT, type of component, lead finish you expected/ received, etc.] * Board type [ie, type of board FR-4/CEM/ceramic, etc.] * Solderability protection on

HELP!! Emerald camera mirror needed!!!

Electronics Forum | Fri Mar 15 17:00:56 EST 2002 | stefwitt

Steve, let me add a more lengthy note on the current service situation, which does not apply for Assembleon alone. I think it was April last year when Nokia re-adjusted their growth rate from 40 % to 10 %. Followed by Motorola�s massive lay off and p

adhesive on pads

Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas

* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo

static electricity buildup

Electronics Forum | Tue Apr 23 01:39:29 EDT 2002 | ianchan

Hi, 1) Was reading the links provided by Dave F, under the thread "waste" which was about the ESD grounding of drums. 2) thanks to Dave F, now have "back-bone" refer sources to explain ESD terms to those who ask and seek to better understand this n


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