Electronics Forum: following (Page 246 of 253)

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan

| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo

Re: Environmental Issues

Electronics Forum | Fri May 22 13:14:42 EDT 1998 | Earl Moon

| | | | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has rece

Re: Micro balls on gold fingers

Electronics Forum | Mon May 18 22:15:20 EDT 1998 | Steve Gregory

Howdy Richard, Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) I know it's not funny to be in that position, but there's so many different places to pick

Re: Micro balls on gold fingers

Electronics Forum | Tue May 19 10:23:06 EDT 1998 | Mike C

| Howdy Richard, | Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) | I know it's not funny to be in that position, but there's so many different places t

Commercial Postings

Electronics Forum | Wed Sep 26 21:31:05 EDT 2001 | davef

We agree in substance and what we are discussing is: degree and perception. There have been many useful, well thoughtout postings on SMTnet by sales types. And the intent of this discussion is to promote more of those contributions, because many sa

AOI ( automated optical inspection) benchmark

Electronics Forum | Tue Feb 19 13:37:48 EST 2002 | PeteC

When evaluating AOI you must first define what type of inspections you want the system to perform, pre-solder or post-solder. What separates many mfgs. of these systems is how effective they are at finding post solder defects. This is where camera re

Process control, SMT inspection and rework

Electronics Forum | Tue Apr 09 21:40:26 EDT 2002 | ianchan

We are a local enterprise with limited resources, just like you described, so hope this experience sharing helps : we place a production Visual Mechanical Inspection (VMI) inspector at the end of each Reflow Oven area, complete with magnify scope 30

capacitors factory

Electronics Forum | Thu May 09 17:07:56 EDT 2002 | davef

Troubles, troubles, troubles. If it weren�t for bad luck, I wouldn't no luck at all, eh? Tough business. Comments on your trouble are: * On machine vision errors from less than ideal capacitors: This is life. Reprogram your machine to either wid

Micro Leadless Frame - solder wetting control

Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan

Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet

Process Capability Studies

Electronics Forum | Thu Aug 22 01:57:30 EDT 2002 | Bob Willis

Although the following is not true capability machine assesment I feel that monioring the process at screen print, placement, reflow and wave gives results for both design and process guys to asses thire process. The project has been running since Ma


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