Electronics Forum: following (Page 26 of 254)

Can you wave solder this part

Electronics Forum | Tue Aug 22 10:31:15 EDT 2006 | aj

All, Is it possible to wave solder the following component? http://www.national.com/packaging/folders/src14a.html aj...

Looking for Fuji GP551E Screen Printer Operating Manual Etc.

Electronics Forum | Thu Sep 14 14:50:08 EDT 2006 | gillmore

I am need of one or all of the following items of literature for a Fuji GP551E Screen Printer: Operating Manual Maintenance Manual Schematic Parts List

Looking for a method to clean up the used PCBA.

Electronics Forum | Wed Sep 27 20:11:19 EDT 2006 | davef

Help us understand your question better by answering the following: * What is a 'used PCBA'? [Are these boards returned from a customer?] * What is on these boards that needs to be cleaned? * How clean do the boards need to be? How is this cleanline

RoHS Board Delamination

Electronics Forum | Tue Oct 24 08:43:16 EDT 2006 | aj

Mark, We have experienced this also. We sent back the effected batch and they supplied us with new ones which did not have the delam problem. We are currently following this up to see what the cause was.If we ever find out! aj...

smd marking code

Electronics Forum | Mon Nov 06 10:11:49 EST 2006 | slthomas

I found the following link here in the fine SMTnet archives: http://www.tkb-4u.com/code/smdcode/indexsmdcode.php

Type 3 vs. Type 4 solder paste

Electronics Forum | Sat Nov 11 07:54:53 EST 2006 | davef

Many use the following guideline when judging the proper paste for a stencil aperature: You want approximately 5 particles minimum across the smallest aperture.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Fri Dec 01 10:18:10 EST 2006 | realchunks

You're right Hussman, I kinda missed the follow thru on that one! Sorry for any confusion on my part boys. Huss, you going to APEX this year? We missed ya last year. L.A. this year....boo!

BGA opens

Electronics Forum | Mon Feb 12 01:09:49 EST 2007 | Wayne

I think the best way is to the following: - to use the low temp solder paste, or - asks semi-con use low temp solder sphere to make BGA

Tantalum influence on other components

Electronics Forum | Tue Aug 12 08:34:31 EDT 2008 | rameshr

hai, in our smt process we are facing the following problem. The Case A tantalum capacitor used in our PCB assembly - during reflow process get shifted, due to which other components nearby that also found missing. what are the causes for this proble

Tape and Reel - IPC/JEDEC or other Standards ?

Electronics Forum | Tue Jan 23 16:49:17 EST 2007 | GMan

Would anyone know what IPC / JEDEC or other standards give tape and reel and/or other packaging instructions? What is the standard followed for component packaging? Thanks!!


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