Electronics Forum | Fri Feb 08 15:23:53 EST 2013 | spitkis2
Anyone know the placement force value (in lbs, kg, or N) on your PnP equipment when placing QFN or Wafer Level CSP's? Is this a parameter you would program for an individual component that is determined to be sensitive / fragile or do you use the
Electronics Forum | Fri Feb 08 15:50:49 EST 2013 | emeto
We usually run QFNs with 2N placement force. However for some parts we will modify the placement to higher value to make sure they stick to the paste good.
Electronics Forum | Wed Feb 20 11:32:41 EST 2013 | emeto
Hi, in my case 2N is the minimal force I can use, so I will use it for most of the QFN we place.
Electronics Forum | Sat Mar 23 23:07:02 EDT 2013 | dhanish
I have a question on component placement 1)for solder paste ,do we need to press the component into solder paste during placement process? 2)how we define force for Smt component..sometimes we add force for certain BGA?any guideline? Pls advise
Electronics Forum | Wed Apr 18 11:37:50 EDT 2018 | nirmex
Hi Sir, Thank you for information and explanation. From your explanation i`am imagining the different Impact Value and Placement Force work like this. Please refer my attachment file.. Nirmal.Viallzoon
Electronics Forum | Mon Feb 17 18:53:34 EST 2020 | richgreen01
Hi all I am experiencing z force sensor errors on a couple of different nozzles ( not hydra ) any help appreciated.
Electronics Forum | Sun Dec 17 13:52:59 EST 2023 | tomdegas
How can I bypass the " Hydra force sensor can't calibrate" during the "Hardware Initialization" test. This is stopping me from starting the machine.
Electronics Forum | Tue Jul 31 15:29:45 EDT 2001 | hinerman
Research was done into the deflection of a totally unsupported (topside) PCB of 0.050" thickness. A dial indicator was placed on the surface and the tooling was set. The deflection ranged from 0.005" to 0.007". This is minor when you consider th
Electronics Forum | Fri Dec 17 16:23:22 EST 1999 | Mike Naddra
Hello Henry, Tombstoning is caused (In most cases) by a force imbalance on either side of the component. As the solder becomes liquidous the surface tension of the liquid will pull the component to the center of the liquidous area. To solve the probl
Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
