Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
Electronics Forum | Thu Jun 12 03:34:23 EDT 2003 | sanjeevc
I would like to ask a question about SMT reflow > process. I did 10 pcs samples but all is fail. > The sample is double faces to have components > (up-side has 4 pcs of BGA and down-side has 3 BGA > and 2 QFP). And I saw some of BGA which is > t
Electronics Forum | Sat Jun 28 08:17:21 EDT 2003 | davef
We form a barrier to contain the dye, but regardless it is messy. Actually, we no longer use dye, per say. We use the stuff machinists use for staining metal. Look here for hints: * http://www.ivf.se/Elektronik/dye_penetrant/edefault.htm * http:
Electronics Forum | Wed Jul 02 12:42:58 EDT 2003 | slthomas
Not sure how else to describe this. We've received some boards (1/2" x 3.5" x .0325" board built on panels of 24) with numerous resistors showing separation of the solder from the metallization at the top of the joint. There are 26 0805's on the bo
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude
What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co
Electronics Forum | Tue Feb 17 10:55:49 EST 2004 | bobbyv40
Hi Dave, 1. As far as speed of removing componants, we use a board preheater to bring board temp to about 150 C. Then add a flux and then flood all 4 sides of the componant with the low temp solder. Using a suction tool the part comes right off. The
Electronics Forum | Mon Mar 08 19:52:54 EST 2004 | Ken
I have processed the following materials in lead free processes: CEM FR1 FR4-120 FR4-140 FR4-170 Each material has different responses to thermal stresses. Issues to consider are: Panel size, smt only, wave only, double sided smt...and smt / wave
Electronics Forum | Thu Apr 29 11:07:03 EDT 2004 | arcandspark
You are right about the very poor support for smaller customers. I had told them we were looking for another paste and now they have sent the reginal manager and the US sales manager has come by to see what they can do for us. All they keep saying is
Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ
The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme
