Electronics Forum: forum (Page 1196 of 7930)

SMT lines in San Diego and Mexico

Electronics Forum | Fri Sep 12 13:13:33 EDT 2003 | babe

Even though I'm in sales and would love a forum that would offer such information! This in my opinion is not the place to ask for such information. I read this area to be enlightened regarding process etc. Not to have salespeople asking questions on

New web site

Electronics Forum | Fri Sep 26 16:49:17 EDT 2003 | lysik

I just want a forum to track the bad apples. They are out their and people need to know who they are and the consumer should be fully aware of policies before you buy something. Sometimes they are unclear or the sales engineer tells fib. GenRad does

Solder defect problem.

Electronics Forum | Thu Nov 27 21:25:15 EST 2003 | Al Capone

Has anyone in this forum experience the can soldering defect? The can component is supposed to be placed on top of a group of RF components to protect the frequency from escaping and interfere with the adjacent RF component. After the reflow process,

4 Sale: Manufacuring Techniques for Surface Mounted Assemblies

Electronics Forum | Fri Jan 23 17:58:30 EST 2004 | Kevin

I have a very good condition copy of Manufacturing Techniques for Surface Mounted Assemblies for sale. If you are interested send me an e-mail offer and I'll send it to you right away. It is presently on sale from SMTA for $200+ Forgive me if this

What's the difference of the OSP, HASL, Ni/Au immersion

Electronics Forum | Mon Apr 05 04:50:28 EDT 2004 | harris

Hello: What's the difference of the OSP, HASL, Ni/Au immersion and ENIG? What's the advantage and disadvantage of them, special for the BGA pad? I had seen some discussion in the forum, but they are for a long time ago. Could somesone can give me the

Cleaning of stencil

Electronics Forum | Tue Apr 20 20:33:38 EDT 2004 | davef

You're correct, alcohol can cure or cause reactions in epoxies. While you're waiting for others to reply: * Read your glue supplier's application notes. They often discuss cleaning procedures and materials. * Consider searching the fine SMTnet Arch

Procedure to evaluate a reflow oven

Electronics Forum | Thu May 27 17:19:56 EDT 2004 | davef

We understand that you modified your oven and want to verify that these changes work properly. Without aguement, that's a good thing to do. Rather than using a procedure [regardless of enlightened it may be B)] proposed in this forum, using the sam

Measuring Voltage of LED

Electronics Forum | Sun May 30 22:59:29 EDT 2004 | snmsmt

I assume your talking about the forward voltage (Vf) of the LED during operation? (Probably not the correct forum for this question but anyway...) My understanding is that 'Vf' is measured during the LED's operation at a forward current ('If') of 20

Plating Thickness at Via Hole

Electronics Forum | Fri Aug 06 07:16:36 EDT 2004 | davef

When moisture outgasses through plating, it continues through the molten solder, causing a meak solder connection. There's another issue with thin plating that we haven't focused on in this thread. If plating is thin, the stress on the barrel of a

SMT tact time

Electronics Forum | Wed Sep 08 03:08:05 EDT 2004 | peter016

Hi Everyone, I am new to this forum. I have posted a similar question on this subject (Chipmounter Plancement Speed). Does the 60% inclusive of the PM and Downtime ? I also find that line balancing also plays a part. For example the Universal GSM II


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