Electronics Forum | Wed Nov 02 11:14:45 EST 2005 | Doug
I am doing lead free testing on a Vitronics selective machine with a 4 mm nozzle. The finishes I am testing are ENIG, ImSn, and ImAg. The problem I am encountering is achieving good top side wetting. Has anyone had any luck with this type of an ap
Electronics Forum | Thu Nov 03 09:43:55 EST 2005 | lupo
Check flux penetration and type of flux. How much is solid contents. The solder filling is better under Nitrogen. Check the time (speed) of the nozzle whether is correct. Usually For SAC305 the temperature of bath is 320C/degrees, but only for sel
Electronics Forum | Wed Nov 02 12:41:07 EST 2005 | Tapesplice.com
Tape Splicer and Tape Splicing Products for splicing a seamless reel of SMD Components. Tape Splicing increases throughputs and yields by 15-20%. We also manufacture Antistatic Clean Room Lab Coats, Clean Room Coveralls, ESD Grounding Straps, Cleanro
Electronics Forum | Wed Nov 02 16:09:50 EST 2005 | jrr3434
My company is looking into buying a batch reflow oven to run quanties varing from 10 to 50 boards per week. Can any one tell me what are the limiations of these ovens? How well can they actually do lead free? What kind of through put can I expect?
Electronics Forum | Thu Nov 03 04:17:07 EST 2005 | Slaine
we had the same problem of getting rid of the heat from the oven. we set up an air line to blow into the oven after parts had been removed that helped a bit. I dont like using them because the profile is not the same every time.So where possible i p
Electronics Forum | Thu Nov 03 11:23:40 EST 2005 | JeffP
Jay, What are your board sizes? What is the maximum size that you envision reflowing? 10-50 boards a week . . . is that in a single run or broken down into a few boards a day/hour? Do you have a high mix or is it a single product? Are the boards
Electronics Forum | Thu Nov 03 12:29:41 EST 2005 | jdengler
Jay, As a CM you can forget about planning the types of boards you will be running. A CM needs to be flexible these days to stay in business. Forget the batch oven they are not flexible and have many limitations as pointed out earlier. Look for a
Electronics Forum | Thu Nov 03 21:40:40 EST 2005 | davef
There maybe multiple drivers to your problems. * First, decreasing bond quality with time indicates a plating issue. What's the actual thickness of your gold and nickel on the pads? * Second, the no-sticks indicate contamination. If it's organic, p
Electronics Forum | Thu Nov 03 10:49:11 EST 2005 | russ
This is what I would propose, Place and reflow the board without the BGA with your lead process, remove the solder from the BGA pads if you cannot mask off the apertures in your stencil. Then place the BGA and reflow to SAC requirements with a rewo
Electronics Forum | Thu Nov 03 12:52:23 EST 2005 | Amol
the only problem i see here is the neighboring components (depending upon the component density) will surely undergo a second reflow during the rework stage for the BGA. this way the only lead you will have in the BGA assembly is if you are using HA
.png)
