Electronics Forum | Mon Jul 03 03:42:32 EDT 2006 | teera
hello, pls check below item for paper stucks: 1)paper rolls diameter not over 60MM(new roll) 2)tension for roller clutch(silver u.s.c only) 3)make sure the under screen cleaner ROUGH ROLLER is clean and free for solder paste.so that it can turn smoot
Electronics Forum | Sun Jun 25 23:17:30 EDT 2006 | Bolos
anyone who can comment and win for me..I prefer a BGA but my designer needs to add 3 dollars for the boards ..how to beat this 3 dollars from manufacturing pooint of view?..with a 15K volume of boards..therefore i need to beat 45K$ ...hell[p[p[[[...
Electronics Forum | Wed Jun 28 21:50:18 EDT 2006 | adihsr
BGA is better- in terms of 1.0 no bent leads or coplanarity problems 2.0 self align on solder pads 3. easy solder printing 4. large pitch ...I think those who goes for QFP have not had a strong SMT experience. Do not be hurt byt this is a basic SMT D
Electronics Forum | Thu Jun 29 05:48:30 EDT 2006 | Loco
The first 3 points are process problems in your own plant. These should be solved anyway. 4th point isnt allways valid. 2 reasons pro qfp: -inspection and repair, do you have a good Xray system? Do you have a good BGA repair process?
Electronics Forum | Wed Jul 12 11:35:07 EDT 2006 | samir
Let's pretend there's no complication with RoHS, backward, foreward compatability - bla, bla, bla Vikings. I would pick the BGA hands-down! 1.) The BGA Ball, the component's lead, IS the solder joint! 2.) No complanarity issues, bent leads, etc
Electronics Forum | Mon Jun 26 00:22:26 EDT 2006 | YQ Deng
Through the pads of conncector(50pin) were printed full solder paste, the solder paste of about 2-5 pads follow to bottom of the connector 2-5 pins, the 2-5 pads outside of connector no any tin after reflow. Is this PCB problem? I can supply failur
Electronics Forum | Mon Jun 26 08:54:35 EDT 2006 | dougs
We have a new product in where a 0.7mm pitch uBGA is to be placed on a 2 layer flexi board. Also a 20thou pitch connector. Has anyone done anything like this before, what should i look out for. Not done much flexi work before so any tips will be g
Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG
Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w
Electronics Forum | Mon Jun 26 12:12:07 EDT 2006 | Rob
Hi JEM, No, it is not required to attach the pads. They have not plated them either, so even if you try it won't be easy. However, the land pattern does supply you with the pads for the "support" pins to sit on & not get soldered to. Semi-helpful
Electronics Forum | Tue Jun 27 09:49:48 EDT 2006 | jem
Thank You for your help. The switch i did try, would not solder and infact the body of the switch started buring. This spec sheet you provided explains why. The spec sheet i picked off the system from my supplier also did not have this info you've p
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