Electronics Forum | Wed Oct 24 02:19:34 EDT 2001 | Leo Gapasin
We have been monitoring our solder defects at post-SMT, post-Wave, etc.in our plant. I want to compare our process performance to a "bench mark" for solder defects at post-SMT. The question I have is what is the "bench mark" for soldering defects in
Electronics Forum | Fri Nov 09 14:23:12 EST 2001 | vickt
You are correct...These are proprietary codes. Your best bet is to stick to the UCT-31. Other folks have tried to create a tool of their own, but have had little success. Universal Instruments offers component library conversion tools as well as patt
Electronics Forum | Thu Oct 25 04:52:17 EDT 2001 | Vai
I'm running intrusive reflow. What happened was when the board went thru' the first reflow ( which is secondary side ), at Post reflow, I can see the solder joint quality is very good smooth and shiny. But when we proceed with the 2nd reflow, at Post
Electronics Forum | Mon Oct 29 16:34:02 EST 2001 | patcope1
I have a custom connector that tends to lift during reflow. The PCB retention tabs and pins are lifting off of the pads on the board and the solder is forming underneath the pads, with no heel or toe filet. Is there anyone out there that can help if
Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas
We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.
Electronics Forum | Mon Oct 29 20:19:44 EST 2001 | davef
DON'T do it!!! The two problems you'll have are: 1 Poor manufacturing process control, resulting in weak solder connections. 2 Weak solder connections are stressed, when the board is straightened upon installation in the "box". There's several hits
Electronics Forum | Tue Oct 30 19:42:44 EST 2001 | davef
Jim Blankenhorn [www.smtplus.com] has the best understanding of designing pads for real life. That�s because he designs them like he wants to design them and doesn�t negotiate with a committee of thousands for an IPC standard. Consider doing this
Electronics Forum | Tue Oct 30 14:39:41 EST 2001 | markhoch
Has anybody else out there had problems with SMT connectors with plastic locating pins lifting up during the reflow process? We've had several instances with several differant types of SMT connectors lifting up during the reflow process. We've even g
Electronics Forum | Tue Oct 30 18:43:31 EST 2001 | mparker
My first thought is board warp. This is something you can't see when the board is in a reflow oven. I see it occasionally going through wave solder. You may need a pallet with hold down clamps for reflow. Try putting a bare board in a baking oven at
Electronics Forum | Fri Nov 02 12:01:26 EST 2001 | mparker
I have two cases where I must bake after DI wash. The moisture entrapment is specifically within microprocessor sockets. Without air gun blow out and baking, oxidation occurs that causes flaky contacts for the PGA. We will bake for 2-3 hours @ 60C. O
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