Electronics Forum: forum (Page 6136 of 7890)

minimum thickness - Gold flash finish

Electronics Forum | Mon Sep 24 10:07:46 EDT 2012 | eezday

The answer, as stated above, is 3 microinch's however, it is equaly important, if not more important, to understand that the only function of the gold is to protect the surfaces beneath it. Only enough gold to cover the nickel beneath it should be u

MPM UP 2000 conveyor misalignment

Electronics Forum | Wed Sep 26 07:40:30 EDT 2012 | highmillr

I had this problem at another plant with the UP 2000....When the machine resets, The left and right side of the conveyor misaligns, causing the conveyor to be tight on the loading end and boards falling out of the unloading end. or vise versa...the t

MPM UP 2000 conveyor misalignment

Electronics Forum | Wed Sep 26 11:18:21 EDT 2012 | swag

You have to loosen the tension on both sides of the drive belt and skip a tooth or two until the cenveyor is parrallel. You'll have to grip the belt tight on one of the drive gears then force the other gear to rotate inside the belt on the other end

MPM UP 2000 conveyor misalignment

Electronics Forum | Mon Oct 08 13:31:50 EDT 2012 | highmillr

Yeah thanks swag, I do that ridiculous routine about every morning....im over it.... so I ordered a new belt..4 weeks lead time by the way from speedline. AND,...I took the tiny belt tensioners on each side and tightened both pretty tight and

mpm UP2000 or mpm AP-25

Electronics Forum | Wed Sep 26 11:42:19 EDT 2012 | comatose

I have an ap-25 and wish i had gotten the UP-2000 instead. How's that for an answer? The main difference is that the ap-25 uses linear motors and air bearings, whereas the up-2000 uses ball screws. The linear motors are faster, but the whole thing i

Reflow problem

Electronics Forum | Wed Sep 26 11:17:38 EDT 2012 | garym4569

We have been having a solder paste reflow issue which results in the solder not wetting to the LED lead. The solder appears to create "puddles" on the pcb pad. I have attached AOI image for review. We have had the pads analyzed for contamination, w

solder black stains after reflow

Electronics Forum | Wed Sep 26 12:16:44 EDT 2012 | bwjm

Hi Guys,recently i am facing an issue. Refer to the attached photo. This PCB is high RF speed, gold immersion single layer. After reflow, my solder seems to have black stains on it. I tried with SAC305 paste water soluble and no-clean, both results a

paper vs emboss (& zig zag placement)

Electronics Forum | Thu Sep 27 15:09:24 EDT 2012 | ericrr

I notice that someone has set all the capacitors & resistors parts as emboss instead of paper tape. Does this make any difference to the pick and placement of the parts, By the way recently we changed from 1206 to 0603 parts, coming out of the mac

paper vs emboss (& zig zag placement)

Electronics Forum | Tue Oct 02 13:55:12 EDT 2012 | ericrr

OK I can take a hint when asked for a photo. I did not try to take a photo as I thought the close up image would put the picture out of focus, so this is where a bit of graphics works might help explain the problem. When I had a look at the 1206 p

paper vs emboss (& zig zag placement)

Electronics Forum | Thu Oct 04 10:54:11 EDT 2012 | eniac

I have only one incredible idea: this is example of different speed of heat transfer of neighboring pads. I saw it two times during last years, but on lead solder pastes (Sn63Pb37). The reason of this mistakes each times we found two: 1. errors duri


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