Electronics Forum | Tue Aug 13 09:47:49 EDT 2002 | johnw
Hi Folk's, a quick and easy? question. Got a card with PTH edge stiffeners fitted to it so we need to flow solder them. Having problems getting hole fill, mainly I think due to 2 things, poor pin to hole ratio and also a bit of oxide. The question i
Electronics Forum | Tue Aug 13 20:57:01 EDT 2002 | davef
We don�t use this glue. What does Heraeus say about your condensate? [I'm With the previous poster. Your condensate sounds like goop from NC flux not glue.] How to clean out a 3 meter length of chimney? Depends on your tolerance for pain * Take
Electronics Forum | Tue Aug 13 13:17:39 EDT 2002 | peterson
We are having trouble with some through-hole connectors "shorting out" on a thick backplane. Preliminary research is suggesting that it may be due to excess flux, trapped under the plastic connector shell. I have done a bit of searching in the fine S
Electronics Forum | Tue Aug 13 13:46:54 EDT 2002 | soupatech
Hello again.... I have been reading up on profiles and how to set them up for different results. I now have an upcomming job with some strict guidlines on reflow. I was wondering... if I were to email a pic of my desired profile could someone out the
Electronics Forum | Fri Aug 16 11:03:22 EDT 2002 | Claude_Couture
I use Kyzen's Aquanox SSA cleaner in a heated parts cleaning tub to clean anything with flux condensate on it. When heated to 120F, the stuff melts away like ice under hot water. When the cleaning solution is loaded, I send it in an evaporator. The s
Electronics Forum | Wed Aug 14 21:13:30 EDT 2002 | davef
Insulating tab approach, like: * Go to page 5 of http://www.kalatel.com/lit-rack/install-man/kts_253_253-16_man.pdf * http://support.tandy.com/support_radios/doc64/64039.htm * Go to �Fixing�, Step 6 of http://www.sunvic.co.uk/TLX%20Digital%20Room%2
Electronics Forum | Wed Aug 14 16:44:54 EDT 2002 | dragonslayr
What is the surface finish? HASL, Entek? what? If HASL, ask your fab supplier for recommendations, maybe even rerun the boards through the HASL process. The fab house would have to strip off the old coating and reapply. Just a thought, depends on y
Electronics Forum | Fri Aug 16 11:13:17 EDT 2002 | kenbliss
I have a question for everyone about component baking. In my view this is rework. The component was manufactured and shipped correctly and should not need baking in order to use it. Some how in storing the component in a stockroom atmosphere (I as
Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss
Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the
Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette
I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com
