Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Thu May 09 22:32:50 EDT 2002 | ianchan
Hi Guys, thanks to everyone for their help and advise! we are running these LCC parts in the 1000's, so its going to pose a big problem to either: 1) tin-plate the oxide layer, 2) HCL away the oxide layer, thanks for the option shown, dun think so
Electronics Forum | Fri May 17 11:00:57 EDT 2002 | Sam Chiocca
Demand Wave Solutions has an inventory control module, BOSSgoldIC, that can be integrated with your present ERP system or implemented individually on an open architecture platform. It is on-line, interactive inventory management system that provides
Electronics Forum | Wed May 22 13:25:45 EDT 2002 | melsolutions
There is a system that Sony uses called Timms. This system has been used worldwide at Sony Electronics manufacturing facilities for over 12 years. They are selling the software package to customers now as a whole full functional product. They have
Electronics Forum | Mon May 20 21:12:54 EDT 2002 | ianchan
xzinxzin, de' process engineer, Hi mate, as an active member of "that other subbie" currently successful in getting acceptable wetting for that MLF, i am not in a favourable position to advise you in process control. hope you can understand this po
Electronics Forum | Fri May 10 14:02:05 EDT 2002 | pjc
First off what bone-head designer put them there in the first place. Vias in solder lands is a big time no no. I had this problem at a CEM I worked at. I had the customer change the design but had to run the 6 samples they supplied. I ended up fillin
Electronics Forum | Tue May 14 14:59:47 EDT 2002 | fmonette
Greg, As Dave pointed out, the main reason to bake components is to remove absorbed moisture from moisture-sensitive components. All you need to know on this subject, including the specific bake conditions (temperature and duration) are clearly s
Electronics Forum | Tue May 14 08:04:58 EDT 2002 | robbied
Hi. Does anyone out there know of a way to calculate the surface area of populated PCB's? We build many different types, and until now have been using a water displacement method, which I believe to be fundamentally flawed. Our technique is to drop a
Electronics Forum | Tue May 14 13:18:33 EDT 2002 | Scott B
I think what David was getting at was, as an example. Take a cubic inch of gold. Surface area = 6 sq/in. Volume = 1 cu/in. Water displacement = X. Mass = Y Roll that cube of gold out to a micron thick. Surface area = football pitch. Volume = 1 cu/i
Electronics Forum | Fri May 17 03:04:15 EDT 2002 | Mike Konrad
This conversation reminds me of the old �How Many Engineers Does It Take To�� joke. We manufacturer the ionic contamination (ROSE, SEC) testers and I am not aware of anyone that performs such exacting surface area calculations. Most people use th
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