Electronics Forum | Thu Jul 20 19:51:40 EDT 2006 | darby
Are you trying to tie someone to an agreed wastage level or are you being tied? What machines are you talking about? What components are you talking about? The only acceptable wastage level is zero: but you can't get to zero until you've had some was
Electronics Forum | Wed Jul 26 16:08:29 EDT 2006 | ev
My focus has moved to the X motor itself. The one common factor in this paricular problem has been the time of year. The day was a particularly hot day with high humidity. Even though there is a "Xfan" connection on the PIAB board I do not believe th
Electronics Forum | Fri Jul 21 03:51:06 EDT 2006 | Rob
Hi CKH, Here's some things to consider: 1) Moved by obstruction in/entering oven, such as nitrogen skirts 2) Incorrect air pressure/air leak in oven (large surface area on component) 3) Reflow temperature too hot & electrolyte/air in cap is expandi
Electronics Forum | Fri Jul 21 10:04:07 EDT 2006 | russ
Well, normally this is from a misplace for some reason and the part is bouncing around the PCB, it should have been on some pads somewhere, Do you know if this assembly also had "missing" parts? Could be temp loss of vacuum during xy seek and part f
Electronics Forum | Sun Jul 23 18:04:51 EDT 2006 | mika
4. There is a possibility that your company have more than one vendor for a specific component (same partnumber for you but different mfg. part nr). Let say that it is a red led and this itself could be somewhat tricky to order: Red led is as most of
Electronics Forum | Sun Jul 23 18:28:59 EDT 2006 | mika
Please be a little bit more specific about your problem. 1. is it all components on every board? 2. is it only components placed from one machine in the line? 3. is the solder paste registration ok? 4. is this a new product, that have never been runn
Electronics Forum | Fri Jul 21 12:15:52 EDT 2006 | CKH
Hi Folk, every now and then, i would encounter Functional Failure due to BGA ICs. The Testing Tech always conclude that the contact of the BGA to the PCB Pad is poor. The 2D/3D X-ray machine can't detect any of the poor contact on the BGA..... We
Electronics Forum | Fri Jul 21 16:47:17 EDT 2006 | stepheniii
Does replacing the BGA fix the problem? To be a little more blunt, is the BGA or is it the tech says it's the BGA. Beleive none of what you hear and only half of what you see. What kind of BGA is it? If it is one of those BGA's with a built in heats
Electronics Forum | Mon Jul 24 13:45:14 EDT 2006 | samir
Most Test Technicians, Managers, and everyone else in the organization always believe that the BGA is the #1, and most likely failure mode in a circuit. You can analyze it with all the tools available...2D, 3D, 10D, underneath, etc...... convince th
Electronics Forum | Wed Jul 26 14:40:28 EDT 2006 | FredC
I just checked a hand full of scrap nozzles and the scuffing is usually on the right or left of the needle. If you have the cross pin facing you and looking down on the nozzle most of the scuffing or wear was on the left side, sometimes on both sides
