Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Mon Apr 06 11:53:50 EDT 2009 | ed_faranda
Here are some pictures of the part. I created a profile for this part. I've been in touch with the vendor and he seems to think the profile is too hot. I am waiting for another board from R&D so I can work on it again. If you look at the picture,
Electronics Forum | Fri Apr 10 07:52:16 EDT 2009 | davef
On cure checking, we have this undated note from Jack Crawford at IPC * IPC-SM-840C "Qualification and Performance of Permanent Solder Mask" has several Test Methods for different types of solder resist material, but probably the only applicable one
Electronics Forum | Wed Apr 08 11:05:53 EDT 2009 | boardhouse
Hi, Need a little more info, 1) this board is definitely delaminated 2) this board looks like a Std FR4 board with 63/37 Hot air finish with probably 140 tg. material. Was this reflowed under lead free temps? 3) Do you Pre-bake product 4) What
Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef
You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1
Electronics Forum | Mon Apr 13 12:06:53 EDT 2009 | jefflkupkt
BoardHouse, Thanks for the reply. The board supplier did cover the cost of the bare boards. Five years ago I saw a different part pass ET only to fail at final assembly test as well. One engineer called it "acid trap" on the inner layers where the
Electronics Forum | Sun Apr 12 08:49:12 EDT 2009 | mki
Hello, I bought used QUAD IVc MKII with transport in "as-is" condition, powered it up (without air and PCB on machine) and all axes (X, Y, Z AND T(heta)shows signs of life. Machine is performing HOME positioning self test. I am not familiar with QUA
Electronics Forum | Mon Apr 13 14:36:18 EDT 2009 | leemeyer
I have seen this problem before. There is a cable that runs from the Quadalign board to the backside of the backplane. It is not secured in any way so it may have come loose in shipping. Open the right side panel on the machine. The Quadalign board
Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef
Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and
Electronics Forum | Tue Apr 14 11:43:30 EDT 2009 | rmitchell
Hi, We are considering adding on to our SMT line. Our current line is CP65, IP3 and we would like better placement on our 0402's and 0201's. We were looking at the NXT, we would need larger pcb table to match our other machines. We probably only nee
