Electronics Forum | Wed Nov 03 07:48:12 EST 1999 | twinston
Jim I have used both software packages. I am currently using Circuit Cam exclusively. I find Circuit Cam interface easier to navigate and it is win32 compliant.
Electronics Forum | Wed Nov 03 12:49:08 EST 1999 | Dave Crowhurst
I came to UniCam from Harris. I have been an end user prior to moving to UniCam as an Application engineer. If you have specific concerns please let me know how I may help you.
Electronics Forum | Sat Dec 04 01:27:32 EST 1999 | Dave Crowhurst
If you have specific questions about funtionality, I can help you if you are still interested. I can also provide you with some reference accounts, that you may contact directly.
Electronics Forum | Mon Nov 01 10:18:44 EST 1999 | NickMata
I am hunting for information relating to Computer Integrated Manufacturing. I know of FabMaster and CIMCIS however I am interested in finding information on other systems available. Any lead/information appreciated. Thanks Nick
Electronics Forum | Mon Nov 01 10:37:30 EST 1999 | Mark Anderson
Also look at GenRad. They offer the complete line of Assembly Programming, Test Development, SCADA, and MES software. Also there is UniCAM, Circuit CAM.
Electronics Forum | Thu Nov 11 15:12:29 EST 1999 | Jamie Marsh
I found a lot of information about UniCam at their web site. Check it out. http://www.unicam.com
Electronics Forum | Mon Nov 01 10:16:42 EST 1999 | Mark Anderson
I am interested in getting some feedback on what different companies are doing to eliminate the solder beading issues on 0603, 0402 chip components using a no-clean process. We are currently incorporating a solder mask removal between the solder lan
Electronics Forum | Sun Oct 31 19:39:26 EST 1999 | Pat Copeland
Parts are falling off on first side when reflowing second side, have tried changing temp profiles, and ended up using tin foil. any recomendations.
Electronics Forum | Mon Nov 01 06:19:45 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
Electronics Forum | Mon Nov 01 06:27:15 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
