Electronics Forum | Fri Dec 12 08:08:33 EST 2014 | cgreiner
I think I have what you are looking for but I am having trouble posting it. Send me your email address and I will send you what I have. Best Regards
Electronics Forum | Thu Dec 18 08:19:19 EST 2014 | oxygensmd
I got it, you're great. Thank you so much! I have a lot manual or service documentation. If you need anything just ask me to help.
Electronics Forum | Wed Dec 10 15:27:14 EST 2014 | sreejhu
Thanks for your reply!! But i dont understand the 300 degree is okay to for lead free process
Electronics Forum | Thu Dec 11 11:00:36 EST 2014 | sreejhu
Hello, So in short, i wanted to know.. for 8 zones i guess that will be a great deal. and the machine made year is 2000. Also, coming to the max. thickness of PCB we have is 0.085 inches.
Electronics Forum | Fri Dec 12 14:20:44 EST 2014 | emeto
there are several ways: 1. Manual method- Remove the part using hot air gun, clean the pads, make a small stencil to re-ball the BGA and it is ready for placement. 2. Improved method - Use equipment dedicated for BGA rework 3. No hassle method - Giv
Electronics Forum | Mon Dec 15 18:10:44 EST 2014 | mcapizzi
We have been specializing in BGA reball since 1991. See our webpage at http://www.pcb-repair.com/ We can do them for you and/or teach you how to do it yourself.
Electronics Forum | Mon Dec 15 18:23:38 EST 2014 | mcapizzi
We have been specializing in BGA reball since 1991. See our webpage at http://www.pcb-repair.com/ We can do them for you and/or teach you how to do it yourself.
Electronics Forum | Sat Dec 13 02:05:23 EST 2014 | pratkul
I want know What is the process of the ODU Control Box Assembly. specially after wave soldering process i need.any one can help.
Electronics Forum | Thu Dec 18 10:12:47 EST 2014 | capse
I represent Epoxy Technology. They supply both epoxies and ployimides for this application. You reach their Applications Support group at (978) 667-3805. If you are located in the southeast you can also contact me.
Electronics Forum | Sun Dec 21 04:19:52 EST 2014 | leadthree
When I worked for a company that did alu-wire dice bonding they used a brand called Hysol for encapsuling. It needed heat cure. It's extremely hard to remove. As far as I remember it's epoxy based.
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