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Electronics Forum: forums/index.cfm (Page 3471 of 7929)

QFN Side fillet

Electronics Forum | Fri Jul 19 13:09:55 EDT 2019 | edhare

Hi, Are you referring to the condition illustrated here? ... https://www.semlab.com/qfn-solder-fillets In this case, the solder was wicked down an attached un-filled PTH via. Ed Hare SEM Lab, Inc.

QFN Side fillet

Electronics Forum | Mon Jul 22 02:13:31 EDT 2019 | jandon

some PQFN package configurations have no toe exposed or do not have a continous solderable surface on the exposed toe and a toe fillet will not form. (IPC-A-610F 8.3.13)

Pin in paste connectors and lead-free questions

Electronics Forum | Thu Aug 22 23:09:34 EDT 2019 | sssamw

Yes, you need work with supplier to see if can run pin in paste for these connectors, even do some experiments. A step-up stencil would be good for these connectors, also connectors pin size and length match with PCB hole design.

mpm up 2000

Electronics Forum | Tue Jul 23 07:55:24 EDT 2019 | ashray

how can I change the language in MPM up 2000? the machine has a default language set to german I wanted to know if it can be changed to English. I tried in BIOS there is no option to do that. Please guide me on this.

Type 4 powder

Electronics Forum | Tue Jul 23 12:55:34 EDT 2019 | cyber_wolf

If you were going from a type 3 to type 4 powder, would you do a full blown documented evaluation ? Flux and alloy remain the same.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 24 10:07:44 EDT 2019 | ameenullakhan

Hi Team, Can anyone suggest me best stencil opening for CCGA. Attached is the component details. Solder paste : water solube - ORL0 - Jtsd 001 ( Sn63/Pb37) Any one has qualified the same. Regards, Ameen

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef

Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 12:47:56 EDT 2019 | davef

Ameen: Send me your email address by selecting the link under my avatar to the left. Thanks.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 07 02:24:54 EDT 2019 | ameenullakhan

Hi Dave, Yes the lead was there before reflow. After reflow it has bent inside. The component was inspected before placement. We are unable to analyze, what might have went wrong. Regards, Ameen

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 09 03:59:35 EDT 2019 | sssamw

Did you check the pin location accuracy before placement? I mean if possible pin was hit or misaligned a little before placement, so the pin cannot inserted in hole then bent. And maybe you need contact your component supplier to study together.


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