Electronics Forum | Wed Oct 17 12:46:55 EDT 2001 | rholland
Does anyone know of an IPC standard callout for testing traces and there connection to pads or vias of manufactured PCB's? I believe it should be on the Fab drawing. At this time we ask for the test on our P.O.'s. Test Voltage (XX)V Single Sides Te
Electronics Forum | Thu Oct 18 12:58:07 EDT 2001 | jacob
Hello, We recently changed a component on one of our products from a .5% 1206 resistor to a .1% resistor. I noticed that there was a greater rejection rate of the .1% resistor during placement. Apparently the thickness of the .1% resistor is less th
Electronics Forum | Sat Oct 20 09:19:24 EDT 2001 | davef
"Phased out" is not the correct term. " Not economic" might be more appropriate. Check: R&D Technical Services (Centech) 12261 Suite A Nicollet Ave S Burnsville, MN 55337 (612) 707-1931 fax 6739 sales@rdtechnicalservices Further, Graham Naisbatt
Electronics Forum | Tue Oct 23 20:12:48 EDT 2001 | dougk
Has anyone has experience using DEK's PumpPrint plastic stencils? We're starting to think about adhesive printing on THT populated boards. These stencils are thick and have undersides routed-out for clinched leads. But, they're plastic, and I'm worri
Electronics Forum | Wed Oct 24 09:11:54 EDT 2001 | John S
Does anyone have any guidelines or IPC standard they can suggest for specifying the type of solder mask used? We've started having problems with poor masking, and when I asked our designers what they use as a specification, they can't give an answer
Electronics Forum | Wed Oct 24 18:26:26 EDT 2001 | gregcr
I am hoping to find out what database format is used in the component library in the Universal Software for the 4785 chipshooter. The format is something like dbase or foxpro or access. This is an old program and I would like to connect to the comp
Electronics Forum | Sun Oct 28 14:06:06 EST 2001 | kenbliss
Hi Paul There is free detailed information on how to reduce changeover time and to reduce bottlenecks on our web site at http://www.blissindustries.com then click on Bliss University, it is written as unbiased information on reducing down time du
Electronics Forum | Mon Oct 29 11:39:09 EST 2001 | Stefan Witte
If you are doing this in a high volume, you could concider using a pin transfer method. Apply solder paste first. Have a plate made with retractable pins in the location you want to have the adhesive dots. Dip the pins into a lake of adhesive. Align
Electronics Forum | Mon Oct 29 14:52:58 EST 2001 | kjmcbi
We have made a number of step up adhesive stencils using a new material called Cirlex. This material demonstrates excellent release characteristics and is easly cleaned. Typically the glue printing is after the solder printing. The stencil is all las
Electronics Forum | Tue Oct 30 08:55:54 EST 2001 | Stefan Witte
Chris, I should have read your request more carefully. .010" glue dot diameter would require at least .005" needle diameter. No way you can do it with the above mentioned machines. You are already stretching the capability of glue machines for 0402 c
