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AOI-problems lifted lead on qfp-100

Electronics Forum | Tue Oct 05 12:29:28 EDT 2010 | mikesewell

It is possible to infer that the lead is lifted based on the toe fillet appearance, but it's not as reliable as say a laser or xray inspection. This is usually done by varying the light source location and or color and looking at the images resultin

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Wed Sep 29 11:25:49 EDT 2010 | mazjal7

Hi, We are placing a Surface Mount connector on a flex circuit, we are planing on using SMT carriers to support the flex through the SMT process. Underneath the connector a stiffener needs to be adhere, I'm not sure if we should have the flex manu

Flex Circuit Assembly Process (Sitiffeners)

Electronics Forum | Fri Oct 01 10:05:29 EDT 2010 | rrpowers

You don't necessarily have to bake the flex circuits, but you do have to worry about moisture. Polyimide is very hydroscopic, and depending on the flex construction, any moisture in the product can lead to delamination. Adhesive based flex circuits

Hand Soldering SMT Cap ?

Electronics Forum | Wed Sep 29 14:19:48 EDT 2010 | davef

In trying to understand your situation better, you say, "The problem is in production. It is difficult to solder SMT package. I was thinking of 1206 package." Please clarify: * What is difficult about hand soldering your SMT part? What is the part

Hand Soldering SMT Cap ?

Electronics Forum | Sun Oct 03 13:32:54 EDT 2010 | schen

Hi. there's no other way to do except hand solder the top side cap or using hand print hand place method during SMT process. otherwise you will have to spend more time just to set up this process. bottom line is you have to install this one cap first

Correlation between Component Density & Machine Performance?

Electronics Forum | Thu Sep 30 16:10:50 EDT 2010 | jeremie

Inherrently there is this perception that the higher the density of components on an SMT assembly the better the machine performance. Would you stand behind this theory? I thought that I would, but I can't seem to prove it mathematically. By that

Westek SMT IV Drying Question

Electronics Forum | Mon Oct 04 15:10:42 EDT 2010 | 18424

Hi Michelle, Due to the dense population of through hole on some boards, after a 35 minute wash, some connectors or battery holders remain wet. Currently we put them into drying ovens at 70c for a Minimum of a half hour. We do occasionally air dry un

Lead-free BGA in Tin/Lead Process

Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp

The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders

SIemens S15 Stick/Vib Feeder Magazines

Electronics Forum | Tue Oct 05 06:39:59 EDT 2010 | walkbury

Hi... We specialize in small/medium production batches and as such, many components are supplied in stick form as opposed to Tape and Reel. We use a variety of stick feeder magazines for the vib feeders, but don't have any for TSSOP devices (specifi

SIemens S15 Stick/Vib Feeder Magazines

Electronics Forum | Fri Oct 08 07:26:22 EDT 2010 | walkbury

Yes... I can generally get away with it for all but the low profile stuff such as tssop packages. The plastic tubes are so shallow anyway that once you've used a scalpel to create a pick up window, you've virtually got no side-wall left. Anything b


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