Electronics Forum | Tue Jun 01 17:37:34 EDT 2004 | lynnmc
Any view on what the minimum reflow temperature is for a SAC ball bga to form a reliable joint with PbSn solder?
Electronics Forum | Tue Jun 01 19:25:19 EDT 2004 | Ken
...oops part 2: I will assume a sac 350 ball??? 217-218C this will completely reflow the ball and form a "normalized" joint with a collapsed structure.
Electronics Forum | Mon May 10 13:15:34 EDT 2004 | ccleland
Purex makes a system for air filtration of aqueous washers. I believe the only fully self contained system available. It returns all cleaning solution back to the cleaner and exhausts clean dry air back to the room. You can contact Dick Wilson at Pur
Electronics Forum | Thu May 06 10:05:58 EDT 2004 | leon
iam having trouble with solder balls around 1206 caps and resistors, have used different pastes changed oven profiles can any advise something else
Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She
Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan
Electronics Forum | Sun May 09 12:59:29 EDT 2004 | Lloydy
Try using the wendy-house style on the specififc area's where you have solder balling. It's not always a good idea to do a global reduction to all apperatures.
Electronics Forum | Thu May 06 15:38:38 EDT 2004 | bmcknight
Does anyone have experience with Dimensions software on Universal GSM platform equipment? Specifically, I'm interested in installing it on OS/2 based machines and need to know if it is compatible. Thanks!
Electronics Forum | Fri May 07 09:00:07 EDT 2004 | Raghu Nippani, Product Manager, Line Level Software UIC
Dimensions is compatible with OS2 machines. Could you please specify what module you are looking for? What level UPS software is running on your machine and what functionality are you looking for?
Electronics Forum | Fri May 07 17:04:02 EDT 2004 | davef
Either method is acceptable: * No IPC approved method * Applying flux only is easier than applying paste * Paste gives a higher stand-off, which should improve reliability
Electronics Forum | Mon May 10 01:20:07 EDT 2004 | longpham246
Hello! Check your stopper up/down sensor position. This problem has nothing to do with the proper data. Sometimes the sensor position is not correct or sensor contact could cause this problem even I/O mode was OK. Regards! LMQ
