Electronics Forum | Mon Jul 01 21:03:15 EDT 2002 | ianchan
Dason: Hi mate, Could you help clarify this abit? ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ we found component weight will reduce more than 50% of the moisture weight after place in the cabinet with 55C and less than 5 % for 48 hours ~~~~~~~~~~~~~~~~~~~~~
Electronics Forum | Tue Jun 25 13:30:42 EDT 2002 | Jeff Park
Folks, I am interested in learning more about solder robbing pads to help and avoid bridging for wave solder applications. I have heard of a few companys that use this process in their design but have not seen any documents for design rules etc.
Electronics Forum | Tue Oct 01 08:01:23 EDT 2002 | mjz289
WE USE A HELLER 1500 EXL OVEN (5 ZONE OVEN) AND HAVE BEEN DOING PBGAs FROM 292 TO 780 BALLS WITH .O32" PITCH (.8 mm) AND METAL STIFFENERS ON TOP WITH NO PROBLEMS. I AM GETTING 210 - 215 DEGREES C AT THE BGA BALLS WITH 50 - 65 SECONDS ABOVE LIQUIDUS
Electronics Forum | Tue Jul 02 21:47:44 EDT 2002 | alex_kirichenko
Hello everybody!!! We are going to start loading 0402s and I'm looking into all diffirent sorts of problems. From this forum I see that tombstoning is the main one. I found article about using U-shape appeture design for 0402s. I never had stenc
Electronics Forum | Fri Jul 12 11:15:00 EDT 2002 | soupatech
I did the search for "lizard" and found a few references but..... WHAT IS IT? I will look into getting some dummy tape and reel BGA's. I just took over this dept. and I am still trying to get an inventory of what size and type feeders we have. It d
Electronics Forum | Wed Jul 17 03:36:00 EDT 2002 | robbied
Answers are: *Mainly copper and potassium. *it looks like a soft growth. *customer will not accept this, hence the returns. These boards are either reworked or scrapped. *Flux is not an issue. *The cleaning process has been found to be the cause of t
Electronics Forum | Tue Aug 27 17:54:19 EDT 2002 | carln
I finally found the answer! I just got back from visiting Smart Sonic out in LA. They have a new chemistry that works great (220-A SMD Adhesive Remover). I took two DEK plastic stencils with me and spread them both with Loctite 3616 and the system
Electronics Forum | Sun Jul 28 23:29:31 EDT 2002 | caldon
Contact Greg Wood at ACI/EMPF. gwood@aciusa.org. Greg will be able to find out the deal. Also, I was part of VDO America who made instrument clusters for VW, BMW, Bombardier, and such and put many instrument clusters through accelerated testing and
Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Wed Sep 11 01:17:59 EDT 2002 | Brian Sloth Bentzen
Hi Steve. My Fuji CP6 is model 643 and are 3 years old, maintained and upgraded with the newest software along the way. And, actually it was Fuji Japan that gave in, not Fuji America. Fuji Japan tested our components and found the same problem and
.gif)
winsouce.jpg)