Electronics Forum: found (Page 231 of 347)

0603 - stencil thickness

Electronics Forum | Fri Jan 03 12:01:46 EST 2003 | jax

Alot of the companies out there use Standards developed internally, centered around there paste, equipment, and reflow processes. Normally you will see either 5mil or 6mil stencils used for everything in house with the exceptions of specific boards.(

BGA voids

Electronics Forum | Mon Jan 13 17:50:54 EST 2003 | jonfox

I was looking for some good documentation that could nail down some pros/cons of voids, but haven't found any. The biggest issue is if you are going to temp cycle the chips/PCB after assembly. Depending on the cycle, the situation of the test, it c

Ceramic capacitors cracking

Electronics Forum | Mon Mar 03 05:35:21 EST 2003 | Kelly

We just had this issue a couple months ago with a single sided FR-4 board which was scored. We found that the design was a factor but also the depth of the v-score. Since then we have re-designed the part further away from the score line. At the same

Production scheduling

Electronics Forum | Fri Mar 14 10:53:41 EST 2003 | Garth

I just can't accept that what I want to do hasn't been thought of before. It's to basic a concept for there not to be an existing product that can at least do something reasonably close. There are too many manufacturing environments and locations f

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor

Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Wed Mar 12 16:04:24 EST 2003 | O' Connor

Everybody thanks for all your help, the problem has been solved. Before I describe the solution I've got to own up, I'm the PCB Design Eng., The Process Eng. lobbed this problem onto my desk last week, said the problem lay with the PCB finish, whats

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Wed Mar 12 17:53:52 EST 2003 | davef

O' Connor Haaa. It's usually the design guys that foist the problems onto my desk. Now that is one shrewd process type that you have working at your company!!!! Can I have his / her name and number to get some tips on the technique that he / she

AOI, Pre or Post Reflow?

Electronics Forum | Wed Mar 12 09:18:10 EST 2003 | MA/NY DDave

Hi Thanks, Going to APEX to see personal demos and hear what they offer and recommend is a great idea. I mean if you want to put AOI everyplace I am sure you will be supported with open arms. What I found interesting in the article was that large

Tantalum caps causing misaligned parts

Electronics Forum | Thu Mar 27 11:39:27 EST 2003 | kenlchin

Hi,mantis, I has experienced this case.when we run a model ,misalignment and tombstone of some 0805 resistors and 1206 caps always occured.we have taken many actions,such as adjusting reflow parameter&printing parameter,checking pcb and parts soldera

BGA Rework

Electronics Forum | Wed Apr 09 05:55:05 EDT 2003 | Chrissie

We've encountered a little problem with BGA's. There was a process problem in the build of the boards which has ment the BGA are failing open circuit due to the lack of solder paste. Any-one else had this problem? Any suggestions on solutions? We've


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