Electronics Forum | Sat Dec 17 08:55:30 EST 2005 | Homer J
Exactly! Maybe I was not clear in my previous thread but this is what I was talking about. Question: How about the Pb exemptions from the RoHS legislation as mention in a previous posting? /Doh'
Electronics Forum | Tue Dec 20 08:48:33 EST 2005 | DannyJ
Finally found the second article mentioned... http://www.emeraldinsight.com/Insight/ViewContentServlet?Filename=Published/EmeraldFullTextArticle/Articles/2190170202.html Dan
Electronics Forum | Thu Jan 05 12:26:20 EST 2006 | Rob
The larger BGA's can also warp more under higher temperatures which causes ball lift, more noticable towards the edges of the package.
Electronics Forum | Thu Jan 05 17:10:04 EST 2006 | russ
The CCGA packages that we install are still a tin/lead alloy and not a SAC alloy. They were 90/10 SN/PB. I beleive that this may be one reason why the difference.
Electronics Forum | Wed Nov 30 21:21:57 EST 2005 | Kwon Jun Kwak
any use the ramp, soak and spike profile methode, or with lead free using the straight ramp approach? What most paste manufactures recomended?
Electronics Forum | Thu Dec 01 11:46:41 EST 2005 | pjc
FYI: Most Sn/Pb and Pb Free solderpastes today are designed to run both a ramp-soak-spike or ramp-spike profiles.
Electronics Forum | Thu Dec 08 22:47:32 EST 2005 | davef
Satisfactory solder paste should: * Be aligned with all pads * Conform to the stencil pad-aperture size * Have a smooth, flat void-free surface
Electronics Forum | Sat Dec 10 07:28:12 EST 2005 | davef
Tin whiskers are real and can cause serious problems. That's why NASA maintains a web page on the issue. [ http://nepp.nasa.gov/whisker/ ] and why space flight is is exempt from Euroland lead-free requirements.
Electronics Forum | Tue Dec 13 21:13:55 EST 2005 | davef
We know nothing of your checklist. Download your free copy of ANSI/ESD 20.20 standard here: http://www.esda.org/s2020.html
Electronics Forum | Thu Dec 15 08:46:02 EST 2005 | Kris
Amol, i am going to piggy back on your question and ask another one is there any information we can get about conformal coating of lead free solder pastes ( WS shuold be no diferent, but what @ no clean ?)
