Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon
My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would
Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef
Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.
Electronics Forum | Fri May 07 02:27:57 EDT 2004 | Grant Petty
Hi, They do what we need component wise, however I was wondering if anyone had info on reliability, ease of programming. We are looking XP 142 and 242 series chip shooters and fine pitch placers. Regards, Grant Blackmagic Design
Electronics Forum | Wed Sep 21 12:30:03 EDT 2005 | Rob
Hi Greg, We've used lots of machines over the years & seen lots of different tape related issues - the main one being snap off of the cover tape, usually due to too much glue, over entusiastic heat seal, or a feeder requiring maintainance. Also the
Electronics Forum | Thu Aug 04 13:58:20 EDT 2016 | sumote
Does anyone have the technical specifications for the Fuji CP6 and the Fuji IP3? Looking for the placement speed (parts per hour), accuracy, smallest/largest component size, fine-pitch (what size it can do). Our new sales guy is putting together some
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
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