Electronics Forum: get (Page 371 of 1323)

Re: Loading leadless parts(passives)by hand

Electronics Forum | Fri Mar 05 09:44:49 EST 1999 | Nancy Vandemark

Clarissa, Dave had good suggestions. We load several boards manual at this time. We set our components up in clearly marked bins. The documentation includes a chart with the part number, bin number, reference designator and color code for the par

Unwetting leads of Palladium Plated Pins

Electronics Forum | Mon Mar 01 11:03:51 EST 1999 | Dennis Xiong

Hello! SMT professionals, I do not know if anyone posted this question before. Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the heel side o

Unwetting leads of Palladium Plated Pins

Electronics Forum | Mon Mar 01 11:03:22 EST 1999 | Dennis Xiong

Hello! SMT professionals, I do not know if anyone posted this question before. Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the heel side o

Re: List By Thread / List By Message

Electronics Forum | Fri Feb 26 11:30:45 EST 1999 | Cunli

Dave, Appreciate your "troubling". As you know we welcome all suggestions and comments. And it indeed will take sometime before we get to evaluate these suggestions. Thanks. | Cunli: I think the phrases are worded accurately and don't think rewo

Re: mask finish and solder balling

Electronics Forum | Sat Feb 20 09:56:22 EST 1999 | Tufty

| We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not b

Squeegee Speed

Electronics Forum | Thu Feb 18 17:49:28 EST 1999 | Ryan Jennens

Hey all- My question is this: My stencil printer operator has said that he has to wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch aperatures for a QFP to release well. We are using Amtech NC-559 type 3 paste with 89.5% metal

Re: Fiducials

Electronics Forum | Mon Feb 22 05:39:58 EST 1999 | Scott Davies

We are currently using circle, cross and double-cross(#) fiducial patterns with SiPlace equipment. Most of the problems seem to occur when, in the case of a HASL fiducial mark, a PCB is topside reflowed, goes away for thru-hole and comes back for bot

Re: Squeegee Pressure

Electronics Forum | Sat Feb 13 07:57:42 EST 1999 | Kelly

| I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the

Re: BGA Shorts?

Electronics Forum | Thu Feb 04 09:22:56 EST 1999 | Terry Burnette

| Hello all, | | Are BGA's easy to develope shorts? If a process is stable and all of a sudden you get BGA's shorting out on you, what might be problems? | | We've checked our solder paste amount, and we've rechecked our reflow profiles and nothin

Re: VOC-FREE FLUX Evaluations

Electronics Forum | Tue Jan 12 19:49:28 EST 1999 | Ross Berntson

| Hi Folks. Has any Process Engineer here done a complete evaluation or controlled experiment for VOC-FREE Flux? Our goal here at CEBUKid, Inc. is to implement a VOC-FREE process. We have all the necessary (OPTIFLUX) spray equipment, and we're cur


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