Electronics Forum: get (Page 936 of 1326)

Re: BGA fab: what's reasonable practise for double sided PCB?

Electronics Forum | Thu Jul 15 16:59:57 EDT 1999 | Glenn Robertson

| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa

Re: BGA fab: what's reasonable practise for double sided PCB?

Electronics Forum | Thu Jul 15 21:18:27 EDT 1999 | Scott McKee

| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa

Re: automatic stencil printers

Electronics Forum | Tue Jul 13 13:58:50 EDT 1999 | JohnW

| We are looking to automate the paste printing portion of our SMT process. We are looking at used equipment from DEK and MPM from 1994 onward.(DEK 260 & 265 MPM AP20 & AP27) Does anyone have some feedback or concerns with any of these machines? Does

Re: automatic stencil printers

Electronics Forum | Tue Jul 13 16:50:20 EDT 1999 | Boca

| We are looking to automate the paste printing portion of our SMT process. We are looking at used equipment from DEK and MPM from 1994 onward.(DEK 260 & 265 MPM AP20 & AP27) Does anyone have some feedback or concerns with any of these machines? Does

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 13:41:42 EDT 1999 | Dave F

snip | | If you go for plugging be sure you have a protrusion spec that you can live with. This often results in little bumps of epoxy that can interfere with component placement. For us, tenting .015 vias usually gets us about 80% coverage from

Re: Through holes in SMT pads

Electronics Forum | Thu Jul 08 12:33:52 EDT 1999 | Mike Demos

Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. I wi

Re: VOC free flux wave solder fixtures

Electronics Forum | Tue Jul 06 12:45:28 EDT 1999 | JohnW

| I've heard that use of VOC free flux with wavesolder fixtures can be challenging due to entrapment of water in the fixture. | | Is anyone out there successfully running VOC free with wave fixtures & did you experience problems? If so, how did you

Re: VOC free flux wave solder fixtures

Electronics Forum | Tue Jul 06 13:02:41 EDT 1999 | John Thorup

| | I've heard that use of VOC free flux with wavesolder fixtures can be challenging due to entrapment of water in the fixture. | | | | Is anyone out there successfully running VOC free with wave fixtures & did you experience problems? If so, how d

Re: Sub-contractor selection

Electronics Forum | Tue Jul 06 12:46:27 EDT 1999 | John Thorup

| | We are looking for some subcontractors to do surface mount | | technology boards for us. Is there anything I should pay specific | | attention when I visit the subcontractor's site? | | Thank you for any advice | | | Wolfgang has a good poi

Re: No clean solder paste

Electronics Forum | Mon Jul 05 18:45:01 EDT 1999 | JohnW

| Is the no clean solder paste as good? We are wondering if we can elliminate the wash when we change from through hole to surface mount. | John, No clean is as good as your process, and the paste you are using. Everything I do is no clean and I h


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