Electronics Forum: give (Page 246 of 457)

Dual lane SMT lines

Electronics Forum | Tue Jul 30 11:43:11 EDT 2024 | sophyluo1985

Correct, you can use a dual-track pick-and-place machine, but the front-end machine must be able to meet your production, such as a printer. If you are back-to-back, what is the CPH of your pick-and-place machine? What is the size of your PCB? If po

parts moving after placement?

Electronics Forum | Tue Aug 06 19:22:15 EDT 2024 | jdengler

Poly, I don't know the UIC GX11 but on other machines I would first look at component height in the program. If it is not in the paste you may have the part height set too high which means you are dropping it onto the past not pushing it into the p

Immersion Silver - Sulphur

Electronics Forum | Sun Feb 23 14:32:42 EST 2003 | davef

Sources of sulphur in PCB fabrication are: * Some locales have high H2S concentrations in the air. * Metal etching steps that use sulfuric acid or a sulfonated buffering compound may result in sulfate residues. * Sulfates can come from contact with

Re: BGA problem: open after reflow

Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F

Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca

Re: Capability Study for Solder Printing Process

Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F

Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board

Re: ICT sites under BGAs

Electronics Forum | Wed Aug 09 22:11:46 EDT 2000 | Dave F

Mark: The best routing of test vias for BGAs is to keep them far away from the device. We route test pads for the outer two rows of balls and use vias as test pads for the inner rows of balls. Your bottom-side layout is fine. Yes, on the top-side

Solder Pot Temperature

Electronics Forum | Mon Feb 05 06:57:52 EST 2001 | PeteC

Dason, IPC/EIA J-STD-001C states: "....temperature within the range of 230C (446F) to 290C (554C)." That's a pretty wide process range. 250C has been typical in the past. We run ours from 230C to 240C. We have found that some single-sided PCBs can de

Solder Paste

Electronics Forum | Thu Apr 19 21:42:10 EDT 2001 | davef

You appear to spending too much time watching "Survivor" and too little down at Jimbo's I'm not sure "Gettin' Jiggy Wit Flux" translates well. My first recollection of jiggy is ... Will Smith "Gettin' Jiggy Wit It" Bring it. Whoo! Unh, unh, unh,

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 08:41:56 EDT 2001 | jimlew

For those of you out there, like myself who are still using 2-d to measure paste ht, I have 2 questions. 1. Typically, what tolerance are you applying to your ht? +- 1 mil, or what? 2. Are you using metal squeegees, and if so, have you found that squ

Desiccants and pcb finish degradation?

Electronics Forum | Tue May 15 21:57:06 EDT 2001 | davef

Welcome!!! Where the hay ya been??? Sorry bud, were lining-up with your fab [it hurts me to say that, but when yer  ] We used to dry pack with desiccants, also. Its probably an old MIL-STD-2073-1C requirement [er something like that]. We qui


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