Electronics Forum | Wed Jun 05 13:01:26 EDT 2002 | Hussman69
Sure do. Spent a couple months with that group last winter trying to get the Soft Beam to solder a small connector board. It really depends on what you are trying to solder. The Soft Beam couldn't handle my job because our board was too small. No
Electronics Forum | Mon Jun 10 01:25:25 EDT 2002 | Ken Bliss
By centralizing to your stockroom all your feeder setups so that one team is assigned to just that, to keep all your 7 lines up and running will reduce the amount of personnel you need and increase throughput. Keep in mind a key factor. The bottlen
Electronics Forum | Fri Oct 11 09:28:14 EDT 2002 | davef
Designers love to do BIG copper pours for several reasons: * Maximize heat spreading. * Increase EMI shielding. * Laziness. The poor folk that solder the parts on boards HATE big copper planes near solder pads. During soldering, fat copper traces [
Electronics Forum | Sat Nov 02 03:13:30 EST 2002 | fdr4prez
Give me a break: If I buy a new machine from them they will make their sales commission off of me, and after the one year warranty they will charge (for example) $100.00 an hour to fix my machine. No problem there. If I buy a machine from the com
Electronics Forum | Fri Nov 08 14:48:58 EST 2002 | davef
Yours is (12 thou x12 thou)/(2x(12 thou +12 thou)x5 thou) = 0.60 * Aspect=W/T for electroformed stencils SB GT 1.1 => Yours is 12 thou/5 thou = 2.40 So, we kind of think of what you�re trying do as maybe printing a 16 pitch QFP, which gives you simi
Electronics Forum | Tue Jun 17 01:27:25 EDT 2003 | Dreamsniper
Hi Guys, I need your opinion here. Has anyone tried doing this Process: Bottomside Process first which means gluing the chip components then reflowing the Glue instead of Curing them, then Topside process which is solder paste printing then compone
Electronics Forum | Thu Aug 21 21:05:39 EDT 2003 | Tom B
Dan, We, do alot of double reflow. Your right we typically see alot of the standards components, SOT's, SOIC's, Chip stuff. The largest we do with out adding epoxy is some 32pin PLCC's. We have several assemblies were were doing PLCC44's, Sockets
Electronics Forum | Thu Jan 22 15:51:08 EST 2004 | solderboffin
CBGA devices are a bit trickier to reball than run of the mil plastic devices. Once assemblied they are a bit like a sandwich when fitted to a PCB. From top to bottom it goes BGA device - Eutectic solder - High temp solder ball - eutectic solder -
Electronics Forum | Wed Jan 28 19:32:26 EST 2004 | Bobby
Joe, You would be best off going with a larger company such as Universal or Mydata at this point. The market is still bad and this is where you will get your best deals. They offer better support than a small company. Small companies like Contact sys
Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc
About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very
