Electronics Forum | Tue Oct 16 06:08:12 EDT 2001 | wbu
Hi Dave, tweaking, oh yes, we did like it to have that job done and not have people sitting around waiting for work or beeing able to deliver on schedule. Nonconformity report, ...ummmmh, weren�t that big that we thought we needed it, actually the t
Electronics Forum | Mon Oct 22 17:37:51 EDT 2001 | davef
I�m aware of no such standard. There may be something in Euroland [ie, IEC, etc.] TM-650 �Test Methods Manual� has procedures for measuring various types of contamination, such as: * 2.2.25 �Detection Of Ionizable Surface Contaminants� * 2.2.27 �Cl
Electronics Forum | Tue Oct 23 20:27:06 EDT 2001 | davef
WOW!!! How do people get these coo toys? Comments are: * IPC-7530 is not a specification. It is merely a guideline. [IPC-7530 �Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)�] * What makes you say a 20-micron intermetall
Electronics Forum | Wed Oct 24 14:06:37 EDT 2001 | mparker
If you let your design team leave things up to chance, chances are something will go wrong. You are right to want to take control rather than be lead down an undesirable path by the fab house. Various masks serve certain desirable purposes. You need
Electronics Forum | Wed Nov 07 17:13:51 EST 2001 | fmonette
Hany, The guidelines for proper handling and storage of moisture sensitive components, like PBGAs are clearly documented in the joint IPC/JEDEC standard J-STD-033 (free download at http://www.jedec.org). In short you need to keep track of exposur
Electronics Forum | Wed Nov 07 21:08:13 EST 2001 | davef
Here ya go ... * K & F Electronics, 33041 Groesbeck Hwy, Fraser, MI, 48026-1514, 1-810-294-8720, 1-810-294-5999, circuits@ix.netcom.com, http://www.circuitboards.com, Richard Kincaid * Hallenbeck, Saturn Electronics [and] Engineering, Inc., 255 Rex
Electronics Forum | Mon Nov 19 20:15:39 EST 2001 | davef
Now, that is one thickass board!!! The rant first: If our �board supplier changed our board surface finish on� anything without our approval, the board supplier would be an �X�. Life has enough surprises. And of all the flat finishes available, h
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Electronics Forum | Thu Jan 10 22:55:24 EST 2002 | davef
You are sure taking you sweet time getting this thing running. You're getting too much beach time. NOZZLE SELECTION Typically, the only rule of thumb that applies to choosing the correct nozzle ID is that it should be one half of the required dot d
Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef
Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla
