Electronics Forum | Sat Nov 17 18:29:02 EST 2007 | bbarton
Let's face it guys...in most cases (stress the MOST!) a typical FR4 board will do the job. Few layers, low copper, not too densly populated etc...no worries. Use a reflow profile which avoids the 245-250C range, use a shorter TAL, Viola you have a go
Electronics Forum | Tue Nov 20 17:07:20 EST 2007 | kennyrebbe
I am looking for a new semi automatic Stencil printer, and reflow oven that is capable of doing double sided boards with BGA�s. We currently own a Manncorp 4500R stencil printer https://www.manncorp.com/4x00_stencil_printers/index.php?view=overview&a
Electronics Forum | Tue Nov 20 19:08:15 EST 2007 | Peter
Hello, I would like to ask for opinion on an epoxy application. We apply RTV to bond and secure 2 electronic devices on a PCB. But after noticing the RTV bond breaking off during vibration test, our customer has specs in a 5min 2-part epoxy (made
Electronics Forum | Fri Dec 14 18:32:39 EST 2007 | kroberson
What machines have you worked with previously? Depending on the programming software used, CP6 can be relativly easy to program. CP6 has been a workhorse in the industry for a long time. One the process is set up, maintain the machines acording t
Electronics Forum | Fri Dec 21 09:20:36 EST 2007 | operator
Hello All, I read AIMs article "Time Above Liquidus". It was very informative and a good read. One thing that the article didn't touch on, that is a mystery to me, is thermal shock to components during the ramp up stage of a profile. If you
Electronics Forum | Fri Dec 28 11:33:36 EST 2007 | realchunks
It really depends on several things. Is solder paste inspection driven from the customer? Do you have a lot of time and bodies to do solder paste inspection? Does it add value to your process? If you answered �Yes� to any of the above, then you a
Electronics Forum | Tue Jan 08 22:48:58 EST 2008 | davef
Maybe these folk can help you with your MTM issues. http://www.mtm.org We appreciate the desire to balance the line with respect to standard insertion time, number of insertions, and number of assemblers. In reality there are too many variables fo
Electronics Forum | Thu Jan 17 11:49:54 EST 2008 | wayne123
HI, I have ran into this a time or two, and what I did before we got the BGA rework station was to run some flux under the component, and since the flux that was in the solder on the other solder joints has at least part of the way burned off in the
Electronics Forum | Wed Jan 30 14:11:15 EST 2008 | slthomas
We dodged it for a while but it was inevitable. Here's the question. What do I REALLY need, and does anyone even agree on it? OK, that's *two* questions. The first board we're likely to do has three parts that will need special consideration. One
Electronics Forum | Fri Feb 29 08:12:56 EST 2008 | davef
Solder paste suppliers often make recommendations on solder paste handling after removing it from the container [eg, jar, cartridge, etc]. For instance, Multicore Solder Paste Handling Guidelines, September 2004 says: As a general rule, paste that h
