Electronics Forum | Mon May 27 18:51:17 EDT 2002 | harotec
Hi Yngwie Have you got a reflow oven yet. If not, forget about complicated profiling with test runs or reflow trackers. We've got a nice oven with integrated temperature-feedback system. You build any profile you want and the oven will adjust its hea
Electronics Forum | Thu Jun 06 02:52:42 EDT 2002 | ianchan
Hi mates, just my 2cents worth... some folks (like us) have product runs that have BGA using no-clean, coupled that with Class3 IPC-A-610 specs, topped with aerospace/military customer defined specs. we end up cleaning NC with a degreaser machine w
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Sun Jun 09 19:02:15 EDT 2002 | Ken G.
Sam, I can tell you right now that if you have a low volume hi mix application where the program/job is changing every day, an AXI system is not going to be a good fit. As you alluded to, the programming time is onerous, the fine tuning or tweaking i
Electronics Forum | Thu Jun 06 09:45:14 EDT 2002 | Hussman69
We based ours on the type of paste we use (stencil life) and not so much the machine. Then we coupled that to what 'true' conditions we normally see in our plant, and determined that under these conditions Max & min) our printing process should be g
Electronics Forum | Thu Jun 13 06:08:57 EDT 2002 | edahi
guys thanks for the suggestions... DaveF, *Changing paste EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current
Electronics Forum | Tue Jun 18 05:40:38 EDT 2002 | ianchan
Hi mates, finally! some sense to all this, so this bloke is concerned about "ppm = quality" variations... looking back through all the muck in this thread, last posting before the s**t hit the ceiling was: ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Date: June
Electronics Forum | Fri Jun 14 14:30:36 EDT 2002 | davef
Assuming you are talking about solderable surfaces: People specify various materials to protect the solderability of the pads on the board. Gold, actually, Electroless Nickel - Immersion Gold [ENIG], is popular. * Board fabricators like it because
Electronics Forum | Mon Jun 17 17:04:15 EDT 2002 | pjc
Guys, Thanks for the input. Its a Opto-Electronic project I'm working on for a customer with a device on a ceramic substrate. Yes, I did learn from Indium that 007 is no-clean and has a high-solids content. They reccommended using TacFlux 010, which
Electronics Forum | Thu Jun 20 15:05:41 EDT 2002 | carln
I saw this system at one of the last APEX Shows. I was not impressed because of the many downsides and potential hazards. Strapping an electrical device on your hand and placing the device into a liquid is kind of like blow-drying your hair in a ba
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