Electronics Forum: gram (Page 1 of 14)

Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 08:30:07 EDT 1999 | Mark Quealy

I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste l

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 17:24:24 EDT 1999 | Deon Nungaray

| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 09:20:39 EDT 1999 | Dave F

| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Wed Jul 21 01:24:06 EDT 1999 | Scott McKee

| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 10:08:30 EDT 1999 | Wolfgang Busko

| | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk pas

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 17:47:28 EDT 1999 | Deon Nungaray

| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 19:09:25 EDT 1999 | JohnW

| | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk pas

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Wed Jul 21 10:05:22 EDT 1999 | Mark Quealy

| | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk p

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Wed Jul 21 11:49:24 EDT 1999 | Deon Nungaray

| | | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk

Re: uBGA placement

Electronics Forum | Wed Aug 04 14:32:02 EDT 1999 | Barney Whalen

| Hi all, | | What is the typical placement head pressure for the GSM1 for placing the micro / chip Scale BGAs ? | | Thanks | Upinder | ======= | Hello Upinder, The typical placement pressure for a GSM1 with Flex head is 150-170 grams. You can p

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