Electronics Forum | Sun Feb 15 16:57:11 EST 2009 | p4qmtto
Hi. We had a similar trouble in a same oven's model. In each one of the heat zones, you have a thermal sensor to avoid an over heat. All of them are conected in a serial circuit with the coil of the main contactor for the preheaters power. If anyone
Electronics Forum | Thu Mar 12 06:23:27 EDT 2009 | gregoryyork
Thanks Nicoleta It is nice to hear the problem is solved and this is a massive problem in the industry especially for Lead Free. It is easy for a supplier who doesn't understand to blame incompatibility just a quick way out but doesn't fix anything
Electronics Forum | Wed Mar 04 15:26:07 EST 2009 | clampron
Hi Jorge, Take a bare board and measure over the same pad. We have had similar issues with a higher deposition than the stencil thickness. In some cases, we have found that the top of the pad was higher than the solder mask. Our inspector uses the b
Electronics Forum | Thu Mar 12 13:26:16 EDT 2009 | rgduval
We're using Sn100C at wave. Well, to be fair, in a static solder pot; as we don't have a lead-free wave machine in operation at the moment. We've had generally good experiences with the SN100. Good soldering; some blow holes, but, since we're usin
Electronics Forum | Tue Mar 17 07:35:37 EDT 2009 | nagesh
We have the IC placer Fuji-IP3 machine.Can this machine be able to place MicroBGA / BGA with good vision system.My card has almost 8 BGA with 4 MicroBGA?Still now i had placed 1 or 2 BGA(Placement by body centering).In this machine the Y- table keeps
Electronics Forum | Thu Mar 26 21:03:24 EDT 2009 | bigdaddysoy9
I have noticed this on some of our large multi-circuit panels. It's such a slight rise in our false call rate that I haven't really explored it. I'm just guessing that it has something to do with the fiducials calculating the twist/shrink of the boar
Electronics Forum | Wed Jun 24 13:52:31 EDT 2009 | jimpat
I have worked with both a batch and 5 zone conveyer oven. Both ovens worked very well. The batch was used for prototypes and low volume processing. Conveyer oven was more efficient when reflowing medium to large quantities. Basically there are ad
Electronics Forum | Fri Apr 10 18:51:39 EDT 2009 | boardhouse
Hi Jeff, Your board supplier could be correct in this way. The board could have had just a hair left of copper on the circuit, which would hold up under the electrical test process, but once you powered it up, then there was enough juice to burn th
Electronics Forum | Wed May 20 07:51:42 EDT 2009 | Jeff
We have a GSM1 with version 1.4. The machine has the old VME chassis. So to upgrade the software (to use enhanced component setup) the VME chassis has to be upgraded. We had UIC in last year to look at this and they would upgrade the VME and software
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
