Electronics Forum | Fri Jun 20 09:38:56 EDT 2003 | caldon
Hi John- First, I do not have first hand experience so my input is pure theory. This type of package (in Some Cases) has a center grounding bonds and leadless legs ups the difficulty tremendously. With no stand-off from the Balls(or Legs) when the so
Electronics Forum | Fri Jun 27 08:34:01 EDT 2003 | caldon
You should also look at the Semiconductor assembly side as well. Datacon and others are working hard to knock down the barriers between SMT and Semi. Also look at process obsolescence! Flip chip has been around for year but has not made it into main
Electronics Forum | Tue Jul 15 11:18:29 EDT 2003 | slthomas
It is an interesting situation....one that merits as much business philosophy analysis as technical analysis. I'll be getting my official 60 day notice today. Any criticism about our overseas suppliers (that were selected by sr. management w/o in
Electronics Forum | Tue Jul 29 09:47:40 EDT 2003 | davef
We agree with Russ and Ioan that rework does not cause black pad. It's caused during the board fabrication process. On the other hand, we think: * Mantis wants to reduce the amount of reworking of boards that fail due to a black pad problem. *
Electronics Forum | Fri Aug 08 08:00:46 EDT 2003 | davef
Matt: You're correct. Do not mess with these boards. If the immersion tin [imm tin] is discolored, it will not solder with routine processes. Ask your customer to return the boards to his / her fabricator and have the imm tin replated. The fabri
Electronics Forum | Tue Aug 12 15:30:50 EDT 2003 | larryk
With components all switching to lead free, I'm just wondering how many of you in the US have switched to lead free soldering processes? How many of you are playing with lead free and have a plan to implement it into your process? I'm interested in
Electronics Forum | Tue Aug 12 16:42:16 EDT 2003 | BBT
Just a note about the EU and no-lead. Not all products are subject to the EU legislation on no-lead. I'm told its consumer electronics, PC, mobile telephones, telephones, games, automotive, etc... those that find themselves into the waste stream. And
Electronics Forum | Wed Aug 13 22:44:26 EDT 2003 | Dean
We have two major industry leading customers that are driving a lead free process. We have chosen to embrace it, invest in the technology and process and become a regional leader in lead-free process. Like most companies we kept current on the tren
Electronics Forum | Mon Sep 08 02:05:19 EDT 2003 | CALVERA
Hello Terry, Thank you for reply. Data what we lost are in the memory. Unfortunately we bought second hand machine and for this machine was include only system disk. Around my country region is support from PANASONIC quite far way and not so flexible
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
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