Electronics Forum | Mon Sep 11 08:52:12 EDT 2006 | Amol Kane
lead-free processes involve higher temperatures. if you run this PCB thru the reflow oven, the worst possible scenario is that the board may melt and deform. even if it doesnt, it may delam internally (and or the bare board reliability might be compr
Electronics Forum | Tue Sep 19 00:35:54 EDT 2006 | darby
Fred, We receive ENIG pcbs in vac-formed bubble wrap with ,of all things, polstyrene packing! Despite my long-lasting complaints nothing has changed. BUT - I have never really had a problem with any of these PCBS. There are no moisture, salt or any o
Electronics Forum | Fri Sep 15 15:51:53 EDT 2006 | MFG CAVEMAN
We have a new product that uses an SMT edge connector. The process we are using is as follows: -Screen print side 1 (no paste on connector pads) -Place Rs & Cs -Reflow -Screen print side 2 (paste on connector pads) -Slide connector into side 2 wet
Electronics Forum | Wed Sep 20 06:01:20 EDT 2006 | bobpan
Sounds to me like your nozzle isnt seating on the z-rod bellows. Pick a nozzle up by do a 'runstep nozzle'.....then do a function 30 ( i hope thats the function because its been YEARS since i worked on a c'series). It should give you a nozzle height
Electronics Forum | Wed Oct 11 09:53:06 EDT 2006 | Rob
Yes, kind of - I had a look through my notes from a while back where we did a lot of work on bending strenght but the only original source I could find was reference to a paper drawn up in 1979 "Increase Terminal to Pad-Peel Strength with a Standard
Electronics Forum | Fri Nov 03 11:06:13 EST 2006 | rgduval
The process that burnt the tips up yesterday was hand soldering/touch up of lead-free assemblies. Not even assembly, but just touching up boards that we've soldered on a solder pot...which will lead to another question. We're using SAC 305 WS482 3
Electronics Forum | Tue Nov 07 18:18:03 EST 2006 | Andrea
I am wondering how to move from hand soldering our ceramic caps to doing a reflow type process. The reason for the change is too many cracked ceramic caps. I have asked our vendors to assemble our boards via reflow but because of our hardware (swaged
Electronics Forum | Tue Nov 07 22:41:48 EST 2006 | davef
You are correct that hand soldering ceramic capacitors often causes them to crack. They do not take thermal shock well. You might be able to reduce the amount of cracking by following the rework repair guidelines discussed in the fine SMTnet Archiv
Electronics Forum | Tue Nov 14 04:52:57 EST 2006 | Loco
To make it even more compicated, you have CTE before Tg and after Tg, altough the after Tg is way more important, because the expantion ratio will be much bigger, a pcb supplier will usually give the before Tg value. To come back to the delamination
Electronics Forum | Fri Nov 17 19:28:36 EST 2006 | rob@spinpcb.com
What kind of board finish do you have? You describe solder bubbles...and when you remove them, you find open vias. Are you, by chance, discovering flux contained in these bubbles? We've been experiencing the same thing with pb-free soldering on a
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