Electronics Forum: has (Page 1141 of 1227)

Re: Design Guides

Electronics Forum | Wed Jul 22 12:47:23 EDT 1998 | Earl Moon

| I'm trying to put together a set of design guides for use for new designers | in house or to be sent out for contracted layout work. I would like to start with a top ten list of things that will go wrong if rules aren't available. For example testp

Re: DI Water Quality Curve??

Electronics Forum | Fri May 22 22:35:23 EDT 1998 | Steve Gregory

Hello there, I've been reading these posts with a little interest as I'm just setting up a contract assembly facility here in Sunnyvale, California. I've learned a few things concerning water quality & filtering bed life that I thought I'd share

Re: Tin-Lead thickness on PWB's

Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach

| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F

| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol

Re: Screen printing the board from........

Electronics Forum | Thu Mar 05 23:33:53 EST 1998 | Ron Costa

| | Hello everyone! | | Does any know anything about bare board size variations? | | Is there a spec. or tolerance? | | I'm running small lots of boards and during the screen printing process | | I find that I cannot paste each board perfectly.I've t

Stencil Printing for 0201 Applications

Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake

Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed

Process Capability Studies

Electronics Forum | Thu Aug 22 01:57:30 EDT 2002 | Bob Willis

Although the following is not true capability machine assesment I feel that monioring the process at screen print, placement, reflow and wave gives results for both design and process guys to asses thire process. The project has been running since Ma

Rep Responses in Forum, Possible Guidelines

Electronics Forum | Mon Oct 14 12:56:50 EDT 2002 | davef

His technical contribution to the forum. From these 24 postings, we can see that 75% of Sean�s postings have a decided commercial bent, as followings: * Could be argued that the posting is a good technical response. Percent of postings 25%. * Could

Freshman in SMT industry needing advice

Electronics Forum | Mon Mar 29 18:17:48 EST 2004 | kerryn

It should be noted that some of the main reasons to change from manual cleaning to automated stencil cleaning are: � Manual cleaning is not consistent � quality is totally in the operators hands � Contamination left on the stencil and in the aperture

Air Bath Rework System

Electronics Forum | Wed Dec 22 20:51:12 EST 2004 | Mark

Yes, shameless. You could have come out and said that APE's equipment is the best thing since sliced bread but . . . you had to get all scientific with us. We already get bombarded by subliminal messages in commercials now, tech forums. In all ser


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