Electronics Forum | Tue Jul 15 16:26:14 EDT 2008 | lharris
Our company has a Novastar benchtop wave solder machine, WSL-P series, model 7PD. We need to replace the pulley drive motor/pump, as some of the teeth on one of the gears are worn down/gone. Any idea where I can procure a replacement? Please provide
Electronics Forum | Wed Jul 16 10:36:16 EDT 2008 | mrmaint
We use a "gold" board to verify the performance of the oven. We chose a scrap board, ran it thru a known good profile and saved the results. We have permanently attached the thermocouples to the board so there is no variance as to where you place the
Electronics Forum | Mon Jul 21 12:13:04 EDT 2008 | shrek
The industry mantra for the past decade or so has been minimizing material costs and inventory turns. Buyers in the EMS are given directives to buy as cheap as possible to meet these directives. Consequently, they cheap out on the most important pa
Electronics Forum | Mon Jul 28 16:48:54 EDT 2008 | pcbbuilders
my oven has a built in profiler, it works fairly well, but it can not predict changes. my main concern was about the time right before reflow. i know that's where the flux is activated and i was worried that i may be spending too much time at the tem
Electronics Forum | Sun Jul 27 03:26:38 EDT 2008 | devinrhode
Im trying to figure out how to go about making a circuit board for making a music box basicly i plug it in. Has two speakers and when you lift the lid it auto plays the music, when you close it.. it stops playing. Very simple. Can anyone help me des
Electronics Forum | Wed Jul 30 10:45:31 EDT 2008 | moimoi
change of carrier tape from monolayer to trilaminate material...we found out through experimentation that the these carrier tape material when combined with a similar cover tape type would react differently even at similar taping parameters. monolaye
Electronics Forum | Sun Aug 03 08:27:41 EDT 2008 | davef
IPC-4553, Specification for Immersion Silver Plating for Printed Circuit Boards, 1.4.1 Solderability. This primary function of IAg is to provide a solderable surface finish, suitable for all surface mount and through-hole assembly applications and wi
Electronics Forum | Mon Aug 11 08:56:28 EDT 2008 | ethancw1sel
The technical support department at Hover-Davis has been very supportive in getting our issues cleared up. And they continue to be so. I was just trying to guage other operators trends with them. I believe we own some odd 600 feeders of various si
Electronics Forum | Mon Aug 11 08:47:31 EDT 2008 | davef
Your MPI (Inspection Procedure) is certainly flawed. Your MPI should have caught this on the first board your produced, before it was reflowed. For help convincing yourself the part is rotated 180*, your choices are: * Get the pin-out of the compone
Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef
There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p
