Electronics Forum: has (Page 811 of 1231)

Re: feeder extension

Electronics Forum | Wed Mar 29 17:10:25 EST 2000 | Jon Wentz

Hi Dave, What feeder model do you have? I took a quick look in my parts list manual and again, depending on your feeder model, you might be able to buy the needed part(s) from Zevatech/Juki. Have you checked with them yet? For example, the main feed

Re: Fluxes

Electronics Forum | Wed Mar 22 17:28:13 EST 2000 | Steve Harshbarger

Donnie, It's funny you ask this question. I just last month was at a company doing exactly what you are asking (Alpha 310 flux with infrared heating). They were successful, but they had 2 important things going for them. 1) A spray fluxer that wa

APEX 2000 is over, or is it just starting?

Electronics Forum | Sat Mar 18 08:20:47 EST 2000 | Wayne Bracy

Just returned from Long Beach and the APEX 2000 show. It has been a number of years of since I attended a trade show and felt the excitement of being on an exhibit floor. All or at least most of the exhibitors seemed to be very busy and looking

Re: clean glue stencil

Electronics Forum | Thu Mar 09 20:48:30 EST 2000 | Dave F

Van Hoang: Welcome to SMTnet!!!! Regarding your problems: 1. Cleaning glue: Check the SMTnet archives. For instance, a recent thread was: cleaning glue off of stencils - pr 13:41:43 03/03/2000 2. Bridging on the wave: Bridging on the wave h

Re: footprint formula

Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko

Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Re: Rework Equipment

Electronics Forum | Tue Feb 29 22:53:13 EST 2000 | KH

I have used both the QX2 and BGA3500 hot air rework system from Metcal; both are great systems; the QX2 is a very simple system for leaded devices, easily trained and very inexpensive compared to SRT, Air Vac, and Conceptronics. The BGA3500 works on

Reflow Power Failure

Electronics Forum | Mon Feb 28 03:46:34 EST 2000 | Hany

Hello 1-In our facility we face a lot of power failures due to the to the city electricity network problems.So, it has hppend many times to loose some PCA's inside the reflow oven. Of course it costs a big money to buy a UPS for a reflow oven. One

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F

Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b

Re: Paste Dispensing

Electronics Forum | Wed Feb 23 11:02:41 EST 2000 | John

John, I'll try to take a crack at it. We manufacture our own boards, and have a high mix. We currently have BOTH a Camalot 2800 Dispenser and a DEK 260 Screen printer. We use the camalot for glue applications, and prototype paste. We use the printe


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