Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Electronics Forum | Thu Jun 09 13:16:44 EDT 2005 | stepheniii
Do you have any parts dedicated on the machine? 100n 0603 or 0805 is probably used on almost everything you build. So why take it off and put it on the machine several times a day. Even if you dedicate only 20 parts to never come off the machine, tha
Electronics Forum | Mon Jun 27 14:20:57 EDT 2005 | Bob R.
If you visually inspect the solder joints of the first dozen or so boards with the Pb free parts and you're meeting workmanship standards then I wouldn't worry about it. When we started getting the first barrage of Pb free parts a couple years ago w
Electronics Forum | Thu Jul 21 03:54:39 EDT 2005 | Rob
Never thought I'd hear myself say this (& I will punish myself later). Whatever you do, don't buy an AP25, CP4 or IP2 for starting out in low volume. 1) You will need a LOT of space 2) You will need a very good constant air supply else the AP25 wil
Electronics Forum | Tue Aug 23 22:09:50 EDT 2005 | Ken
You can put a 15, 32, 45, 54 mm lens on a Topaz. However, the 54mm has no published specs. Standard config would use the 45fov single cam. Remember the larger the fov the lower the resolution. Oh and for you guys out there who like the parts per
Electronics Forum | Wed Jul 20 16:08:34 EDT 2005 | grantp
Hi, I think the comment about the board height is because the MYDATA checks the board height each time it loads a tool so this is eliminated from being an issue because the machine knows the PCB height. I don't think it's so much what height the PCB
Electronics Forum | Tue Jul 19 12:12:02 EDT 2005 | chunks
I have a QFP 160 used on 9 different products that had high fall out for "Insufficient Solder". Basically, a leg or two would pop free when inspected occasionally. This same part is used on different size products, located at different area of each
Electronics Forum | Fri Jul 22 03:07:45 EDT 2005 | Joseph
Dear all, As we know there is a high risk of reliability issue due to lead contamination during mixture of NLF component at LF wave soldering process. But we have the following feed back from one of our customer as follow: Concerning the risk of m
Electronics Forum | Fri Aug 12 22:10:24 EDT 2005 | Mika
I agree with all the prior postings! But I have some additional thoughts about this. If there is a build up of moistures (% humidity) inside the pcb; before you reflow the pcba; then you will have the result out of the oven, just as you described. My
Electronics Forum | Wed Aug 10 10:41:23 EDT 2005 | patrickbruneel
Bob, Great theory if you're selling SN100C, but I have to disagree that an alloy being 4�C off eutectic will cause cracks. When a solder joint exits the solder wave, there is an immediate drop in temperature of 100�C. so being off 4�C is irrelevant.