Electronics Forum | Mon Jan 12 18:40:32 EST 2004 | fastek
You don't want dedicated tooling. Make sure your machine comes with front and rear dams and plenty of side chucks and magnetic support pins. The best option for these machines is the side snugger option but it doesn't sound like your machine has that
Electronics Forum | Tue Jan 13 23:44:23 EST 2004 | fastek
If I may clarify something as to not give the wrong idea. As a used equipment dealer my focus is on the cost of ownership only for myself and the buyer at the entry point. I was assuming (perhaps incorrectly) from the gentleman's statement that the m
Electronics Forum | Fri Jan 16 07:48:29 EST 2004 | Mika
We usually program the components in the component database with pin 1 in the lower left corner. Then in the feeder database we set the component orientaion to 270 deg for Tray feeders(turn the tray in the feeder 180 deg) and "tube" feeders. For tape
Electronics Forum | Fri Jan 16 07:06:47 EST 2004 | Mika
Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA? We populate 64 I/O uBGA's on our pcb's with 0.3 mm
Electronics Forum | Wed Jan 21 11:02:41 EST 2004 | highfallsfunding
Hi Andreas. The SMPI is a proprietary Universal board transfer protocol. GSM platforms from about 1996 and newer have both SMEMA and SMPI. Although UIC later called it BPP1 (Board Pass Protocol) and BPP2, which is basically SMPI for lane-1 and SMP
Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude
What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co
Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny
Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro
Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef
Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati
Electronics Forum | Wed Jan 28 08:11:20 EST 2004 | stefwitt
Martin, may I ask what your offer is? Does the pick and place machine vendor provide you with a special nozzle, which would not require the peel off cover. Custom nozzles from the OEM are quite expensive, because they implement engineering and test.
Electronics Forum | Tue Feb 03 12:39:20 EST 2004 | paul_bmc
We had the data at the time and it was quite high. More false calls then anything. I do not have the data anymore it since has been archived. When the system was introduced we had 1 engineer and 2 operators trained for programming and running the
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