Electronics Forum | Tue Feb 01 22:10:09 EST 2005 | davef
Try: http://www.gerbergrab.co.uk We have no relationship, nor receive benefit from the company referenced above.
Electronics Forum | Tue Feb 01 22:31:51 EST 2005 | Passerby
I may be wrong, but I think one of smtnet's advertisers have something that does this too.. No idea how good, bad or ugly it is or even if appropriate, but try: http://www.unisoft-cim.com/gerber_connection.htm
Electronics Forum | Tue Feb 01 15:01:02 EST 2005 | mee13
California has a lead free plan set to go into effect on jan1 2007
Electronics Forum | Wed Feb 02 08:39:33 EST 2005 | David N Nadel
Looking for non magnetic 1% surface mount resistors. Does anyone have a clue where to find them?
Electronics Forum | Wed Feb 02 18:01:22 EST 2005 | russ
I would call it conservative, but definitely recommended. It sort of depends on your assembly design. We have run 140 boards lead free but are now using the 170. Russ
Electronics Forum | Mon Mar 07 15:35:35 EST 2005 | John M
It has been my experience that the standard Fr4 material (Tg 135c) will discolor when processed at the new higher temperatures required for the high tin alloys... We have been using the High Tg Fr4 (Tg 170c) for many years to ensure this does not hap
Electronics Forum | Wed Feb 02 16:24:14 EST 2005 | bobsavenger
I would like to know if anyone has an IPC specification for BGA's handy? I'm looking for specifics based on Classification. Roundness, %voids, size, etc. Please let me know if you have this. Thanks Bob
Electronics Forum | Sun Feb 06 12:59:33 EST 2005 | GC
Please try to use 6-8 mils ..you are overloading pads surface ..Please verify paste volume vs surface..Have fun
Electronics Forum | Tue Feb 08 06:43:56 EST 2005 | dhanashekar
we have even tried with 6mil stencil even than we are getting the solder ball thanks for your suggestion
Electronics Forum | Tue Feb 08 10:33:26 EST 2005 | Dougs
have you had any reduction in aperture size though, we generally use a 6 mil stencil thickness with a 10% aperture size reduction for chip components and leaded components ( SOIC - QFP ) and a 1:1 ratio for BGA components without any problems.
