Electronics Forum | Tue May 01 07:54:10 EDT 2001 | bdoyle
We have been experiencing some problems with the email system but have been, and will continue to work on it. I would recommend that the associate resend the email for now. We appologize for any inconvenience this might cause. -Brian
Electronics Forum | Tue May 01 20:18:37 EDT 2001 | jwdyer
I have a PTF that is blowing the MMIT card on the PTF. Anyone have any ideas why? It's OK until the PTF begins the zero process. Thanks, Dyer
Electronics Forum | Thu Aug 24 13:09:30 EDT 2000 | Dr. Ning-Cheng Lee
Yes, a flux with a fast wetting rate will be more prone to have spattering. Fluxes with high boiling point solvents are also more prone to have spattering, if the same flux is fast in wetting rate.
Electronics Forum | Thu Jun 14 16:33:32 EDT 2001 | pr
I have found all the advantages (that others have spoken about) are true. One thing to look at is the quick disconnect system that MPM offers which will reduce changeover times to almost the same as blades. It's well designed and so far, for us, has
Electronics Forum | Wed Jun 20 11:51:55 EDT 2001 | Steve
Speculation is dangerous. If the test is part of the spec and your CM assures you that it is being done, unless you have a high failure rate, you need to believe it is happening. If you have seen an increase in failures, I would defenately call the
Electronics Forum | Wed Jun 20 21:58:37 EDT 2001 | fmonette
Dave, if you have a level 6 then you have no other option then to bake it and reflow before it exceeds the specified floor life. For more details check out the joint IPC/JEDEC standard J-STD-033. It can be downloaded for free at http://www.jedec.org.
Electronics Forum | Wed Jul 04 11:07:46 EDT 2001 | a.m.
Hi Mike, What type of component you have the problem? For a quick refernce you have two points for the ideal dot: 1- Dot size = 2/3 of area of glue (pad to pad) 2- Dot height = pad thickness + component stand off
Electronics Forum | Mon Jul 30 17:44:55 EDT 2001 | Carlton F.
You mentioned a few specific machines that this technology is working with now. Which have had the best results? Which have experienced problems and what were they? What changes are planned for the ones in current use if any? Thanks
Electronics Forum | Wed Aug 01 12:34:12 EDT 2001 | JohnW
The material has to be injected from beneath the component, it's a 240 pin QFP, ideally I wouldn't want the material gong past teh leads as I have to have the option to rework the thing if, perish the thought, it fail's and need's fixed.....
Electronics Forum | Mon Jan 31 17:09:14 EST 2000 | John McMasters
I would assume the IP2 version is similar to the IP3. I've installed 2 of the IP3 ones and they work fine. The retro is pretty simple. Tape and reel is fine if you have the room on the MFU's, we didn't have that luxury though.
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